Electronics Forum | Tue Apr 30 21:13:43 EDT 2019 | marcarmo
Caro amigo Charlien poderia me dizer como proceder o item 11? do arquivo pdf ms parameter window? para mover a cabeça para bloco de calibração? deve ter algum comando ou atalho no teclado para movimentar a cabeça dela e baixar a cabeça até nivel de c
Electronics Forum | Tue May 22 18:21:15 EDT 2001 | davef
Again not quite what your looking for, but close, consider IPC-2221, Generic Standard On Printed Board Design, Para. 4.4.4 for minimum requirements for edge board connectors, as a baseline.
Electronics Forum | Tue Jul 03 21:16:34 EDT 2001 | davef
No glue on solderable surfaces. Glue is centered between pads. Consider A-610C, "Acceptability Of Electronic Assemblies", para 12.
Electronics Forum | Wed Dec 15 18:09:10 EST 2004 | DasonC
Jedec J-STD-033A for components. For the Fab and assy, you can check IPC-PE-740, Para. 1.5.4
Electronics Forum | Sun Jan 01 21:02:54 EST 2006 | sumxp
Please elaborate more on hole fill issue.How difficult to optimise the process para?
Electronics Forum | Thu Mar 15 03:24:48 EST 2001 | Scott B
We are currently having a conflict of opinion with our QA department regarding the very few occurences we have of chip resistors being soldered upside down (i.e. the resistive element towards the board). IPC-A-610C para 12.3.2 specifies that this co
Electronics Forum | Wed Dec 10 12:15:41 EST 1997 | Bob Willis
Does any one know of good articles on the DSRS I have never seen a complete article only a couple of paras. I am writting a guide for the SMART Group in Europe which we are selling to raise money for charity just like our latest report on Pin In Hole
Electronics Forum | Mon Nov 27 12:17:02 EST 2000 | Dason C
Chris, you are not completely right. Our industrial is following the IPC standard as our guideline. Per IPC J-STD-033 has specify the floor life at para. 8 (normal condition at 30C/60%RH). If Victor can control his environment at 32% then the compo
Electronics Forum | Wed Jan 31 17:45:37 EST 2001 | dason_c
Hi! William, please check the new IPC-A-610 Rev C, para 12.4.10 for the soldeirng anomalies. Most of them may consider as process indicator and not the defect. The most common method to elimate the solder ball is to reduce the solder volume by red
Electronics Forum | Tue May 29 20:22:19 EDT 2001 | davef
Well, no fault with your calculations from here. They appear to be correct. [Logic doesn't appear to be off to far off base, either. An epiphany, eh?] As mentioned in an earlier posting on this thread, consider following the recommendations of IP
