Electronics Forum | Tue Aug 28 08:28:30 EDT 2012 | rgduval
We agree with all of the previous comments, and would add the following: Warpage is generally caused by excess moisture in the raw boards. Have you tried baking the boards prior to assembly? We had this issue on a simple 4-layer board, and found t
Electronics Forum | Mon Aug 27 13:02:32 EDT 2012 | rway
We will look at the oven speed. We considered stiffeners but opted against that due to the risk of moving parts pre-reflow due to handling. 90 deg? I don't know. This may or may not help with the bowing. Considering there is little to no substra
Electronics Forum | Mon Aug 27 12:51:32 EDT 2012 | cobham1
I have run 0.031 boards. One of the things you may want to look at is the speed of the oven. With 14 zones you may be going to slow with the board which could be the reason your boards are starting to bow. You might also think about adding stiffners
Electronics Forum | Mon May 13 06:15:12 EDT 2019 | dhanish
how to control warpage on panelized pcb during reflow process.we are already running with pallet.Encountering problem to insert the pcb into pallet after first reflow cycle.The insertion is being done by robotic arm. Any recommendation on the profile
Electronics Forum | Thu May 23 10:21:19 EDT 2019 | emeto
What is the material of this PCB?
Electronics Forum | Mon Jul 01 04:39:49 EDT 2019 | sssamw
yes, You need tell us how the PCB and board designed, size, material, how de-paneling the PCB?
Electronics Forum | Mon Jul 01 09:33:08 EDT 2019 | dbuschel
if you can't change the PCB materials or design at this point, you might be able to reduce it somewhat through the use of fixtures or edge stiffeners. Unless it is a particularly thick board, I don't think the reflow profile would be the issue. The t
Electronics Forum | Mon May 13 23:44:26 EDT 2019 | dami0629
if use tray cannot solve the problem, you can change from the design 1）Reduce the effect of temperature on PCB 2) PCB USE HIGH TG 3) BOARD THICKNESS TOO THIN 4) MODIFY THE BOARD SIZE 5) Reduce the V-CUT depth.
Electronics Forum | Mon May 13 06:38:41 EDT 2019 | relaycz
You need to give us a little more information. 1. What is the size of your panel? 2. Are there any heavy components? 3. What is the thickness of your board panel? 4. What kind of oven are you using? 5. Is it only a recent problem or ongoing one?
Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton
I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer
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