Electronics Forum | Wed Jul 21 11:12:05 EDT 2010 | remullis
I have some 13" long boards that warp considerably during first pass through reflow (no center support), what I've done to improve this type of warpage is stiffeners along the front and back edge. This may help with twisted boards as well.
Electronics Forum | Mon Dec 13 07:34:10 EST 2010 | davef
Here's a link to a recent thread on warpage http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=63244
Electronics Forum | Tue Jan 04 16:06:13 EST 2011 | davef
To get started, here's a recent thread about board warp: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=15249&mc=7
Electronics Forum | Fri Aug 30 11:17:19 EDT 2013 | jth
Hi, the BGA and/or the PCB may be warping excessively during reflow. We offer testing services to measure warpage of BGAs and PCBs during reflow to JEDEC and IPC standards. Let me know if you'd like to learn more about our services: joe@zntechnolo
Electronics Forum | Tue Jun 16 11:04:11 EDT 2015 | cyber_wolf
Who are the experts in the U.S. regarding polyimide bare board manufacturing ? We are struggling with warpage issues....
Electronics Forum | Thu Apr 20 13:55:31 EDT 2006 | cyber_wolf
Here is the problem : We have 2 AP25 printers with dedicated tooling. After we run side one boards through reflow, we get some warpage in our boards occasionally.(Sometimes we get a lot of warp depending on the geometries of the substrate) When the
Electronics Forum | Tue Jul 20 14:17:34 EDT 1999 | Curtis
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Fri Apr 17 07:45:43 EDT 1998 | Robert Meston
We have to mount our SMD devices 0.1 to 0.4 mm off the pcb PCb substrate to compensate for thermal stressing in a Space enviroment. Has any one any ideas or contacts for dissolvable pads. this only applies to leadless components
Electronics Forum | Mon Jun 01 17:49:39 EDT 2009 | gregoryyork
Sorry looking at your profile again and considering its Aluminium substrate I would opt for an increase to the preheat or introduce a soak to the profile to get the PCB up to reflow. Try soaking between 175 - 200C sufficient enough to heat the whole
Electronics Forum | Fri Jul 23 02:17:26 EDT 2010 | joseph_smile
by viewing your posting i came to know this is solder ability issue which is because of marginable solder ability of PCB / components, just ensure that issue due to PCB or component . check the msl of of substrate / component. verify the baking r
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