Electronics Forum: pcb thermal shock ipc (Page 1 of 13)

Re: Rework induced thermal shock of SMD capacitors

Electronics Forum | Sun Jan 11 11:28:14 EST 1998 | Bob Willis

Most componnent cracking is mechanicaly produced a guide to causes of capacitor damage is included as a download file on my web page www.bobwillis.co.uk I feel that the supplier is looking to blame some one else. IPC make comment on pre heating chip

Re: Rework induced thermal shock of SMD capacitors

Electronics Forum | Sun Jan 11 11:28:12 EST 1998 | Bob Willis

Most componnent cracking is mechanicaly produced a guide to causes of capacitor damage is included as a download file on my web page www.bobwillis.co.uk I feel that the supplier is looking to blame some one else. IPC make comment on pre heating chip

PCB Thermal shock

Electronics Forum | Sat Nov 03 05:41:07 EST 2001 | Ben

Hi Could somesomeone help to let me know can bare PCB (FR4) is damaged by thermal shock? Can difference of CTE from copper or solder to FR4 damage PCB from apply heat too fast? Any specification or standard can i refer? Thank you Ben

PCB Thermal shock

Electronics Forum | Mon Nov 05 20:34:03 EST 2001 | davef

What�s the problem? There area many heat related failure mechanisms in bare boards. You can damage boards with heat several ways. A couple favorites [Don�t try this at home. Perform on a closed track by professional solders only.] are: * Put a

Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Fri Oct 01 10:04:20 EDT 1999 | Andrew William Dalrymple

I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at rewor

Number of thermal excursions per componet

Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef

BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar

Re: Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Thu Oct 14 10:49:13 EDT 1999 | Dan Woodward

Andrew, As I read about issues with reworking connectors, whether they are surface mount or PTH soldered, I wonder if compliant pin pressfit connectors are being considered. They are easily assembled after all SMT without any thermal input, and on e

Re: Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F

| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at

Re: Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell

| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir

Re: Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian

| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at

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