Electronics Forum | Wed Jan 26 01:39:12 EST 2005 | sohct
Is there a procedure for the this test? If yes please forward to me. Thx.
Electronics Forum | Wed Jan 26 09:27:41 EST 2005 | davef
Look here for more on dye & pry: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25007
Electronics Forum | Thu Jun 25 22:25:24 EDT 2009 | boardhouse
In the life of this product that you have been doing this process, has the material alway's been IT180 material? One problem with Lead free material is that it is more fragile that standard FR4 Epoxy laminate. And is known to have chipping or fractu
Electronics Forum | Wed Nov 12 15:48:36 EST 2003 | johnwnz
Thanks for the info Dave, the link provides very interesting reading! btw, JohnW and JohnWnz are one and the same, I've moved down to Sunny New Zealand to ply my trade / skills down here and have soem fun in the sun while I'm at it. A move I'd total
Electronics Forum | Mon Dec 08 17:06:59 EST 2008 | boardhouse
Hi MGL, Couple things to ask, have the boards recently been changed to Rohs builds? STD FR4 to High TD Laminate. Check the stack-up the board houses are using. Just about all Rohs laminate has Resin starvation issues when used in single ply co
Electronics Forum | Wed Aug 19 08:00:55 EDT 1998 | Earl Moon
| Hi there, | I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In orde
Electronics Forum | Tue Sep 14 10:25:37 EDT 1999 | Earl Moon
| I'm hoping to use 0201 caps and resistors in a new design but so far have only found one company who makes such small devices (Murato). | | Can anyone direct me to any other supplier? | | Are there any particular problems associated with using s
Electronics Forum | Tue Apr 29 07:38:42 EDT 2008 | davef
Warpage typically (not always) kinda, sorta points to a fabrication bake induced issue that is the racking technique & may be relieved by "flat baking" under weight. Your baking at 125* won't do dip. You need to get the laminate temperature above it'
Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
Electronics Forum | Tue May 08 03:14:12 EDT 2001 | sinclair
We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/cooling @ 70/-5 degree C yield 40% of failure. With
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