Electronics Forum | Fri Jan 25 12:23:07 EST 2013 | dontfeedphils
By "they've been through the wash cycle twice" what do you mean? What kind of cleaning process do you use? What sort of chemistry? How do you handle the assemblies after wash and before coating? Do the operators where power free gloves? -Phil
Electronics Forum | Tue Feb 26 11:19:31 EST 2013 | anton99
Stephen, That's true and I am going to include the reflow time in our changeovers. That way if its taking to long to change the oven temperature it will show up in our metrics. I agree, if we miss a step in the changeover process our metrics will be
Electronics Forum | Fri Feb 15 13:27:46 EST 2013 | adrianus
Hi Dave, Yes, that makes sense, are you sure that this standard covers Nickel Silver alloys as well? I've been asking Thanks,
Electronics Forum | Fri Feb 15 14:45:30 EST 2013 | davef
Yes, the standard applies to things that are soldered. Read this ipc.org/TOC/J-STD-002C.pdf BR, davef
Electronics Forum | Wed Feb 27 19:40:21 EST 2013 | jaimebc
For yellow colored tantalum caps, try using Fusion light (P5. For pre process use green filter. Let me know if that works for you. I've had the best results with this setting.
Electronics Forum | Mon Mar 18 16:06:35 EDT 2013 | emeto
The paste is going to roll as before because you have to apply the coating on the bottom side of the stencil. Also the coating that wears out will most probably go to your stencil cleaning paper as that the process wehn you actually have friction wit
Electronics Forum | Sat Mar 23 23:07:02 EDT 2013 | dhanish
I have a question on component placement 1)for solder paste ,do we need to press the component into solder paste during placement process? 2)how we define force for Smt component..sometimes we add force for certain BGA?any guideline? Pls advise
Electronics Forum | Mon Mar 25 14:41:50 EDT 2013 | markhoch
Just a thought, but have you pulled the datasheet for the part and confirmed that the plating on the leads is compatible with your current process/profile?
Electronics Forum | Sun Mar 31 00:42:09 EDT 2013 | dhanish
Why we cannot run Pb Free BGA with Sn/Pb process but we can run high temp BGA(90/10) with Sn/Pb? Both require high temperature to form the IMC.Why there is a difference in the reliability?
Electronics Forum | Mon Apr 01 10:15:22 EDT 2013 | babe7362000
I have to agree with you. We do go by piece rate not by time. Also who is supposed to make a process, the Man.Eng., or the lead? I would think the Man. Eng and the lead should make sure everyone is following it?
