Electronics Forum | Tue Jan 06 04:37:21 EST 2009 | janz
Tack test - follow IPC standard TM650 #2.4.44. Regards Janz
Electronics Forum | Thu Jan 24 11:47:15 EST 2002 | Joe B.
Are there any formalized standards for the properties of solder balls? Example properties: sphericity uniformity(variance) of the ball size distribution surface roughness surface oxidation or other surface treatments/contaminants ?? As someone rela
Electronics Forum | Fri Jul 06 10:08:21 EDT 2007 | blnorman
The coating thickness is more a property of the individual coating itself. The 0.03 - 0.13 is based on average properties of acrylics in general. It's like trying to pour 3 mils of motor oil on a table. The material will find it's own thickness.
Electronics Forum | Fri Sep 17 01:19:02 EDT 2010 | sachu_70
I suggest you have a look at the method and detergents used during cleaning / washing these smocks. This would help to understand if the smock properties deteriorated on account of such process. In addition, you could keep one unused sample for over
Electronics Forum | Thu Oct 08 20:59:59 EDT 2020 | sosigguy
hello, have you solved this issue yet? can you not use the teaching function for a part to set the pickup position? I believe we have worked around by changing the property of one of the feeder types(i think we used Stick-B) under the machine proper
Electronics Forum | Thu Nov 28 09:51:37 EST 2002 | davef
I got here before the experts did. Underwriters Laboratory Incorporated is an organization located in the United States and is purely concerned with product safety performance. UL operates laboratories for the investigation of materials, products,
Electronics Forum | Fri Jul 21 12:55:32 EDT 2023 | davef
From ESD Systems [ https://esdsystems.descoindustries.com/QuestionsandAnswers/ShowQuestion.aspx?i=405 ] Antistatic Property of some Kapton® Tapes - Tribocharging when removed from a surface or unwound from the core: - 3M's Tape # 42 generates from
Electronics Forum | Sun Dec 28 15:19:49 EST 2008 | davef
A long time ago, Phil Zarrow wrote �Evaluating solder paste - not an option� to give tools for evaluating various solder paste properties. You are interested in �post placement tack.� Find Phil's paper at: * His site http://www.itmconsulting.org *
Electronics Forum | Tue Mar 09 14:53:16 EST 2010 | davef
Resistivity Of Solvent Extract [ROSE] is a bulk ion contamination [BIC] test method. It should thought of as a process control tool used to assess ionic contaminants. Don't consider it an acceptable tool for establishing 'GO-NOGO' limits. The stan
Electronics Forum | Mon Aug 23 03:12:57 EDT 2010 | grahamcooper22
Possible route causes of bridging on fine pitch ICs are; too much paste (stencil aperture wrong), poor print quality (paste smudges during printing), pcb pads not flat depending on the solderable coating, paste has poor cold slump properties, too muc
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