Electronics Forum | Thu Apr 25 04:22:14 EDT 2002 | ianchan
We have an internal debate whether to calibrate equipment using K-type thermocouple made out of : 1) fibreglass braided, with a 482 deg-C peak-measurement properties? 2) teflon FEP(fluorinated Ethylene Proplene), with 204 deg-C peak-measurement p
Electronics Forum | Thu Mar 01 19:27:48 EST 2007 | Wayne
Yes, I am currently using Viromet 347 at the moment for my SMT lines. 100-150, 35 sec 150-207, 40 sec 207-above, 80 sec peak temp: 225 deg C. It is compatible to SAC paste in term of solderability and wettability. But in term of mechanical property (
Electronics Forum | Thu Nov 17 11:38:35 EST 2011 | deanm
We use both the blue static dissipative and black conductive ESD totes to store/transport our electronic assemblies. Our problem is that they get dusty/dirty and periodically need to be cleaned using ESD cleaner and a paper towel. Being that human na
Electronics Forum | Sun Mar 01 04:24:06 EST 2015 | 3dpcb
Thanks Sarason, You are right that chemists and physicists now have some new tricks. Using nano-chemistry the physical properties of the materials change. The melting temperature of our nano-particle silver is below 150C. The insulator is also a nano
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Thu Nov 09 01:17:28 EST 2000 | DL
John, Ahhhh the possibilities. Have you considered the dissipative properties of available substrates? A ceramic (excellent heat dissipation) based substrate could be a possibility for future designs. Maybe there are surface mount parts out there fo
Electronics Forum | Tue Oct 31 23:32:31 EST 2000 | DL
Have You adjusted the placement properties of your pick n place machine/software for a 0402, I'm thinking x, y and add a little z. seems to work for me :) (as a temp/perm fix) thinking also about the numerous variables involved. Your printing process
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Thu Aug 24 13:31:55 EDT 2000 | Dave F
At room temperature, how long does it take for the phases of a common tin (Sn) / lead (Pb) solder, say 60/40, to reach equilibrium? While the materials are diffusing toward equilibrium do the material properties of the solder change significantly?
Electronics Forum | Thu Aug 24 16:54:33 EDT 2000 | Dr. Ning-Cheng Lee
52In/48Sn solder has a melting point 118C, and can be reflow processed at temperature down to around 165-170C. The material is very soft, very low in shear strength. It is relatively ductile, can be stretched to about 2-3X of Sn63 in elongation. Amon
winsouce.jpg)
