Electronics Forum | Thu Aug 24 13:18:24 EDT 2000 | Dave F
What are the primary indium (In) / tin (Sn) intermetallic compounds (IMC)? What are the drivers to the formation of In/Sn IMC? Copper / tin IMC are very bittle and, while necessary for proper solder connection formtion, are ment to be minimized. W
Electronics Forum | Thu Aug 24 16:44:27 EDT 2000 | Dr. Ning-Cheng Lee
There is no IMC composition can be identified in phase diagram of In/Sn. There are some compositions such as In3Sn or InSn4 cited in earlier literature. Those composition should be regarded as approximate representation of solid solution of In/Sn. I
Electronics Forum | Wed Aug 23 16:40:30 EDT 2000 | Dr. Ning-Cheng Lee
During the second reflow, the solder remelts and resolidifies. In general, the reflow temperature is not high enough to erase the microstructure developed during the first reflow. As a result, the net effect of a second reflow typically is grain coar
Electronics Forum | Thu Jul 20 13:01:07 EDT 2000 | qsheng
What is the difference of formulation No-Clean Sn63 with No-Clean lead free paste? Is there techniocal data in detail for performance property of No-Clean lead free paste (for example, viscosity, solderability, tack, print life, reflow profile)? Is
Electronics Forum | Thu Feb 03 21:20:50 EST 2000 | Dave F
Ignacio: Try: Electronic Packaging & Interconnection Handbook, Harper, (ISBN 0070266948) Printed Circuit Board Materials Handbook Jawitz, MW McGraw-Hill 1997 (ISBN 0070324883) merix.com/resourcecntr/materials/mtl_property_comp.html norplex.com/TD_L
Electronics Forum | Wed Oct 17 18:42:37 EDT 2001 | scott
Any processes that I need to be aware of that differs from standard FR4 during reflow and wave soldering? I've read one of the problems is the thermal expansion of teflon is quite different from copper. I've also seen a "blurb" where teflon absor
Electronics Forum | Mon May 06 21:39:46 EDT 2002 | Yannick
Hi, I would like to know if someone is using a immersion AG for their board and if this plating modify the property of the solder paste? do I need to make changes on my temperature profile? We want to change from HASL to Immersion AG to mount
Electronics Forum | Wed Aug 21 10:20:05 EDT 2002 | ksfacinelli
Dave, I am interested in a amine hydrochloride activated flux. Can you give suggestions on readily available fluxes that you have used that have strong deoxidization properties. I am looking at something that could be used in a pinch when the stan
Electronics Forum | Wed Sep 18 15:13:17 EDT 2002 | davef
Effects of Gold (Au) on Solder Properties Concentration Range in Weight Percentage w/o Au in Sn63/Pb37 Solder [A Sugarman/Loranger] * 2.0 - 3.0% Spreadability and fluidity of solder reduced (1) * 3.0% Highest acceptable concentration of Au in solder
Electronics Forum | Mon May 05 11:35:00 EDT 2003 | Grant
Hi, This is an interesting point. I use Koki paste from Japan, and it's wonderful, however what properties of solder paste would make it "anti tombstone" paste? How does led free effect tomb-stoning? That would be interesting to know. We might go
