Electronics Forum | Thu Nov 19 06:33:45 EST 1998 | Des
I have a requirement to reform the legs on flat pack devices (en-masse) due to materials handling problems. I am aware of the pitfalls in reworking any IC in this way however I have no choice in the matter. I have found one suitable machine on the we
Electronics Forum | Thu Nov 19 11:59:58 EST 1998 | Dave F
| I have a requirement to reform the legs on flat pack devices (en-masse) due to materials handling problems. I am aware of the pitfalls in reworking any IC in this way however I have no choice in the matter. I have found one suitable machine on the
Electronics Forum | Fri Mar 23 07:39:34 EDT 2007 | namruht
I have tried to teach the part a couple of different ways. I have the component taught as a Quad Flat Pack and I am ignoring two of the sides. This has provided better results but still not consistent.
Electronics Forum | Tue Mar 27 15:18:19 EDT 2007 | jmelson
Chrisw said : We have used the older and newer style Mantis scopes and our assemblers love them as you can do rework in a very natural and comfortable seating position. It took me a while fooling around to get everything in the right place, but I c
Electronics Forum | Tue Oct 29 14:24:24 EST 2002 | genny
SOP small outline package SOIC small outline integrated circuit TSOP thin SOP TSSOP thin shrink SOP PQFP plastic quad flat pack (also CQFP is ceramic QFP) LQFP low profile QFP VQFP I don't know QSOP a guess is 'quad small outline pkg'
Electronics Forum | Fri Jul 18 07:14:10 EDT 2003 | davef
BGA - Ball grid array QFP - Quad flat pack As a bonus, look here to learn more SMT terms and definitions http://www.smtnet.com/library/index.cfm?fuseaction=content_terms1 There are other listings of definitions and terms in the SMTnet Library. Lo
Electronics Forum | Tue Sep 30 21:00:41 EDT 2003 | davef
We're not clear on what you seek. So, as a starting point for our discussion, we wouldn't get agitated if we saw "routine" coplanarity of 4 thou. For instance: Maximum Lead Coplanarity [Altera] Package||Acronym||Lead material||Finish||Maximum Lead
Electronics Forum | Fri Mar 27 07:45:38 EST 1998 | Matt P.
I am specing out a desk-top type SMD proto-typing and reworking machine for low volume application. Capabilities to 10 mill pitch on a 160 lead quad pack are required. Any suggestions? Thanks, Matt
Electronics Forum | Tue Oct 29 15:07:38 EST 2002 | gregp
SOP small outline package, SOIC small outline integrated circuit, VSOP very small outline package, TSOP thin small outline package,TSSOP thin shrink small outline package, QSOP ???, LQFP low profile quad flat pack, VQFP ??? The packages come and go
Electronics Forum | Tue Jan 20 06:38:06 EST 1998 | Igmar
Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this com
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