Electronics Forum | Sat Mar 16 17:53:06 EST 2002 | davef
Not an unusual problem, especially for nc flux users. Search the fine SMTnet Archives for background.
Electronics Forum | Wed Mar 20 11:21:57 EST 2002 | Hussman
It's all in the way you design your stencil.
Electronics Forum | Sat Mar 16 11:06:48 EST 2002 | Lau
Hi, I am searching a method of reflow process for less / nothing solder ball defect. Thank Lau
Electronics Forum | Tue Mar 19 09:29:08 EST 2002 | Basaran
What type of solder ball defect that you want to avoid is it voids or misregistration or ball-pad adhesion. Cemal Basaran
Electronics Forum | Fri Sep 13 18:58:12 EDT 2002 | slthomas
I can't give you itemized values for each defect category because we don't ask operators to distinguish between them, and we haven't done any serious research to do so either. I do wonder this, though. I read data somewhere from 14 years ago statin
Electronics Forum | Wed Aug 01 08:58:02 EDT 2018 | 2219576
Please check the solder paste height near PCB edges, Please check board clamping during solder paste printing. Please check tooling support boards must be fixed during the printing process. try to set wiper cleaning frequency and fine tune for best
Electronics Forum | Tue Aug 14 13:54:57 EDT 2018 | etmpalletguy
Vlad, Reduce your aperture opening in the stencil, this will give the stencil a good seal around the specific area of concern. In a wave solder environment, solder balling top or bottom surfaces in a wave pallet is caused by excessive flux burning o
Electronics Forum | Tue Sep 27 11:43:32 EDT 2016 | tnisbet
Yes you can open the tolerance, and that’ll usually work for a bit. Is the LAE is linked to multiple parts? If so, then the easiest thing is to open the tolerance. If not, that’ll require another route to try. Is it happening to all of the components
Electronics Forum | Wed Jan 11 18:59:22 EST 2023 | agrivon
At SMT assembly level, the main HiP mitigation actions to consider should be increasing the stencil thickness/aperture sizes (typically in the 4 corners where warpage is maximal) + possibly reducing the reflow peak temperature as probably indicated i
Electronics Forum | Thu Apr 28 01:40:14 EDT 2022 | sophyluo1985
Advantages of SPI 1. Reduce defects SPI was first used to reduce defects caused by improperly printed solder paste. Therefore, the primary advantage of SPI is its ability to reduce defects. Defects have always been a major problem when it comes to
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