Electronics Forum | Fri May 29 16:14:23 EDT 1998 | Jason Gregory
Thanks for the advice, Steve. Hard-headed people in high-ranking positions spells trouble.
Electronics Forum | Fri May 29 12:30:03 EDT 1998 | Jason Gregory
Hi everyone, this is my first time on this forum. I've only been an innocent bystander. Until now. I wonder if anyone out there knows of any technical publication (accessible over the net) that explains, in detail, the actual physics involved regardi
Electronics Forum | Fri May 29 20:15:15 EDT 1998 | Steve Gregory
Whoo-doggies Jason, you said a mouthfull!! (GRIN) Anyways, 'member what I said about me being a pack-rat? Guess what? I found some documentation that I've had for a while that does document the self-alignment forces that goes on when reflowing. I ha
Electronics Forum | Fri May 29 13:42:34 EDT 1998 | Steve Gregory
Hi Jason! I can probably find something documented for you, but the easiest way to convince your QA people is just to show them. If you have a board around that has some 1206 locations all in a row, print the board with paste and then plac
Electronics Forum | Fri May 29 16:12:11 EDT 1998 | Jason Gregory
| Hi Jason! | I can probably find something documented for you, but the easiest way to convince your QA people is just to show them. | If you have a board around that has some 1206 locations all in a row, print the board with paste and the
Electronics Forum | Tue Dec 28 12:55:16 EST 1999 | Justin Medernach
Greg, The best advice that I can give you is a PBGA will respond just like any other surface mount package. There may be a 5 degree delta between a PBGA 356 and a QFP208 but the two respond very similarly in the convection reflow environment. CBGAs
Electronics Forum | Thu Sep 13 11:21:45 EDT 2001 | aldo_maldonado
We've had several instances of parts (1206R, SOT-23) popping off of their location during reflow. Parts placement is OK, paste brick is aligned and compact before oven. But we get random parts off their location just lying somewhere else on the boar
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Mon Dec 30 23:51:13 EST 2013 | vileo72
Hi Dave , Thanks and will align accordingly .
Electronics Forum | Fri Jul 28 11:12:18 EDT 2023 | shrikant_borkar
Hi SimionR, Is Glue Process Dispencing or Glue Printing thru Stencil? if Its Dispencing Glue thru a Nozzle then its a controllable process. I have performed it thru HDP-3 Panasonic. Placement of Glue either one DOT or Process must be aligned with th
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