Electronics Forum | Fri Jan 08 06:14:32 EST 2016 | bobpan
There should be a regulator to adjust the puff off on the inside left back panel. Remove the left side cover to get to it. Write down what its set at prior to adjusting it. I have also seen this problem caused by water in the system. Make sure that y
Electronics Forum | Thu Jan 07 15:48:03 EST 2016 | ahanna
Hey everybody! So my Quad 4000c has been acting funny lately. When it goes to dumb a rejected part into the dump bucket it doesn't actually drop the component. This results in it trying to pick up another part with the previous part still on the nozz
Electronics Forum | Fri Jan 08 08:29:48 EST 2016 | ahanna
Water can be the issue. After Christmas break we came back to find a fair amount of water build up in our airlines for the building. I will check out the regulator as well as the solenoid. Thank you. I appreciate it.
Electronics Forum | Tue Nov 13 19:52:47 EST 2001 | davef
1800??? That's not a Mictor part number. Huh? What??? Haaaa!!!! You gotta do what???? 1800 ofem??? Haaaa!!!! Sorry. It�s simple. Just ... * Cut all the SMT gull wing leads on both sides of the connector just above the solder. * Put the co
Electronics Forum | Thu Jul 30 03:34:52 EDT 2009 | babe7362000
The parts are from 2000-2004. The temperature at the leads are between 215-220. When the part is removed from the board, some of the leads are nice and shiny and some have dewetting, so I dont think it is a temperature issue.
Electronics Forum | Wed Jul 29 12:48:25 EDT 2009 | mikesewell
Kester R562 is listed as an ORH0, a high activity flux, not sure switching pastes would gain much. What is the finish on the leads? How old are the parts? You could have the parts reconditioned (SixSigma, Corfin, ...others) but this can get costly
Electronics Forum | Wed Jul 29 10:46:04 EDT 2009 | babe7362000
I was wondering if anyone knows the best way to clean oxides off of fine pitch components? Apparently the paste we use does not have strong enough flux to remove the oxides off of the leads of the components. I have validated the profile and that i
Electronics Forum | Fri Jul 13 12:21:41 EDT 2018 | emeto
The right way in your case is to use shield with cover. Place, reflow, remove shield pick up rails/tabs, AOI, close cover.
Electronics Forum | Wed Aug 23 02:09:48 EDT 2017 | vincent1991
hi dear i must say the machine has optimized but i want to reduce the time . i want but i afraid to reduce delay to make defect part or machine dump it . so i need the best peak & place delay time for all component .
Electronics Forum | Thu Sep 15 09:31:02 EDT 2016 | ladmo1
While removing one part, another part - BGA part - several components away, actually melted on one corner - you can see the plastic body of the part oozing out around one corner between the solder balls. Several of the solder balls on the one corner
