Electronics Forum | Wed Dec 19 09:24:21 EST 2012 | swag
Many times we manually add flux from the top side for good fill.
Electronics Forum | Wed Dec 19 09:41:14 EST 2012 | dyoungquist
What is your solder pot temperature? We found that on a 0.093" multilayer board increasing the temp of the lead free solder from 300C to 315C helped with the barrel fill.
Electronics Forum | Mon May 14 16:36:58 EDT 2012 | davef
You're thinking correctly in trying to improve your process. Can you change to a more active flux? Look at the copper that connects to the center pin. You may need to relay-out the board to add a wagon wheel style thermal relief in that area.
Electronics Forum | Tue Dec 18 10:14:14 EST 2012 | moshesh
In those cases where we have a 3.2mm thick, 16-layer board with several GND layers, do we still need ground connection to each and every layer (with thermal relief) or, skip part of the ground patterns? Will it help soldeing rising. I can't reach mor
Electronics Forum | Wed Dec 19 11:12:05 EST 2012 | aj
have you considered intrusive reflow? I ran a product similar to what you are describing and the only way we could get sufficient holefill consistently was by this process.... there may be obvious reasons why you cant but worth a shot if you can- it
Electronics Forum | Mon May 14 12:44:08 EDT 2012 | tomgervascio
I am a user of an Ersa Versaflow 3/45. I was wondering if anyone could share some process pointers. I have a 0.125" multilayer PCB that I am having problems consistently achieving 75 percent hole fill on a mini-coax connector. The coax connector ha
Electronics Forum | Wed Aug 21 17:03:13 EDT 2013 | hegemon
I think your pre-heat temp is a little low for SAC 305 Soldering. Especially with a Pallet. You might want to try to add some time and temp to get the PWB itself preheated up to 150-160C. That should help with the barrel fill. Make sure your board
Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew
I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag
Electronics Forum | Thu Nov 03 09:43:55 EST 2005 | lupo
Check flux penetration and type of flux. How much is solid contents. The solder filling is better under Nitrogen. Check the time (speed) of the nozzle whether is correct. Usually For SAC305 the temperature of bath is 320C/degrees, but only for sel
Electronics Forum | Fri Jun 23 12:54:53 EDT 2017 | guts1872
We are having issues with top fill and dropping pins on Molex connectors with our KISS 101. Unfortunately we do not have a pre heater and bottom side pre heat with our nozzles is not satisfactory. Most of the issues occur when using a no clean proces
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