Electronics Forum | Thu Jan 06 15:51:08 EST 2011 | flipit
Nitrogen increase surface tension in solder. This also reduces solder balls.
Electronics Forum | Fri Dec 06 18:13:15 EST 2002 | slthomas
We only have solder balling problems in the interface of the pcb with the selective soldering pallet. All other boards (single, and double sided glue and waved alike) are fine, so I'm not thinking this is going to follow the normal path for resoluti
Electronics Forum | Tue Jul 06 10:46:12 EDT 2004 | blnorman
We have now switched to Kester EP256. During our solder paste evaluation, resistance to humidity was one of the selection criteria. We printed multiple boards, then exposed them to 85�F/65% RH. At 30 minutes, 1 hour, 2 hours, and 4 hours exposure
Electronics Forum | Mon Dec 02 13:16:31 EST 2002 | kenBliss
Hi Steve The people who will have the answer is the experts at EMC Global Technologies. They know their stuff, they are the leader in the solder pallet industry. They design and build them to work right. http://www.emcgti.com for contact info. Hop
Electronics Forum | Mon Dec 02 18:01:12 EST 2002 | GSW
Hi, Try to check if there is water absorbed in the flux or the humidity around the wave area. possibly plating on barrels that might be damaged?
Electronics Forum | Tue Dec 03 15:26:07 EST 2002 | GSW
This might be a trival mundane suggestion but try to use non conductive plate to hold components. Probably even made of the pallet material. I am sure your pallet fabricator will have tons of scrap and he can help you find one. T
Electronics Forum | Wed Dec 04 14:09:52 EST 2002 | Vince Whipple
By the way, what type of preheaters do you have? IR? Convection? If you have IR, there may be a way to cheat. Vince W
Electronics Forum | Tue Dec 17 08:38:30 EST 2002 | Randy Villeneuve
Jim, In most cases if you can eliminate a process you will save money. With that in mind, an all surface mount or all through hole design is prefered. There are alternatives to that rule, like hybrid designs that can be pin and paste soldered. It al
Electronics Forum | Mon Dec 02 17:02:28 EST 2002 | Vince Whipple
Steve, I agree with the recommendation to check the temperature. This is the first place to go. Is this an IPA or water based Noclean? What is the topside temp of the assembly at the effected areas? If you are too cold you will have a tendency to hav
Electronics Forum | Wed Dec 04 09:24:52 EST 2002 | jseagle
I have found that preheating the solder pallets prior to use helps cut down on the solder balling. Also, we do not cool the pallets between passes and we use a spray fluxer because a hot pallet will knock down the head on a foam fluxer. We use WS f
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