Electronics Forum | Fri Dec 15 03:16:11 EST 2006 | pavel_murtishev
Good morning, The critical points for successful PIP technology are: 1. Gap between THT lead and PHT hole. It shouldn�t be greater that 0.2mm; 2. Lead shape. THT leads MUST be straight or you�ll get excessive voiding otherwise; 3. As Russ said, pas
Electronics Forum | Tue Sep 01 09:02:24 EDT 1998 | Justin Medernach
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Mon Jul 14 12:11:17 EDT 2014 | rgduval
We used to use the Tapesplicer tool available from http://www.tapesplice.com (Sierra Electronics), in a high mix, low volume environment with MyData's (older feeders). Short review: It worked. Longer review: First, technique is everything. Splicin
Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway
As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa
Electronics Forum | Thu Jul 20 12:51:50 EDT 2000 | Tekguy2000
We are currently running boards with resistor paks on the solder side of the board introducing these to the wave solder. We cannot get rid of shorting between the leads. We are using a water soluble acohol based flux. The option of going to selective
Electronics Forum | Wed Mar 04 11:47:42 EST 2009 | patrickbruneel
I have to correct something from my previous post (before someone else corrects me). You can grow dendrites from any conductive surface (Cu, Ni etc.) but the final stage would be lower SIR. In my experience other metals except for tin do not lead to
Electronics Forum | Tue Aug 07 09:44:44 EDT 2012 | parmar01
Hi All Im new to the forums, And this my first thread. im the production manager at Broyce Control Everything ive learnt about wave soldering is by trail and error i know its not the best way but it has worked for me. The problem i have been
Electronics Forum | Mon Mar 25 10:22:20 EDT 2013 | rgduval
You mentioned that you changed the layout some, and this can be essential in this type of process. If the SMT parts and TH leads have inadequate spacing on the bottom side, shorts may be inevitable (someone else will have to advise what the recommen
Electronics Forum | Wed Jun 16 15:40:47 EDT 1999 | Jagman
I've been asked to put together a "Technology Road Map" that shows the direction components (technology) and the equipment that places them might be taking for the next 10 years. For instance, micro BGA might require more sophisticated pick-and-plac
Electronics Forum | Thu Apr 22 10:21:16 EDT 2010 | remullis
I am looking for anyone who has a C5 or equivalent that has successfully been able to pass large QFP parts that require 4 lead sets. The part I am working on is 31.75mm. The vision system takes four snapshots of the part and stitches the information
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