Electronics Forum: siplace performance monitoring (Page 5 of 13)

Re: optimum solder paste height

Electronics Forum | Mon Dec 29 14:47:36 EST 1997 | justin medernach

| how to determine the optimum solder paste height ? Ray, This is a gross misconception within the industry. There is no optimum solder paste height, per say. The effectiveness of a solder joint should be quantified in volume. Use your process as

Solder Defects

Electronics Forum | Wed Oct 24 02:19:34 EDT 2001 | Leo Gapasin

We have been monitoring our solder defects at post-SMT, post-Wave, etc.in our plant. I want to compare our process performance to a "bench mark" for solder defects at post-SMT. The question I have is what is the "bench mark" for soldering defects in

PCB & MSD Component baking oven

Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara

We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma

Solder paste handing

Electronics Forum | Sat Jan 13 03:43:38 EST 2007 | Stephen- SMT engineer trainee

We are now using solder paste(OM325) and I have some problems on the folowing process: 1. We use the solder paste softer(Malcom SP-1) to warm-up for 20 mins, when it just take from refrigerator. Is there any problems for solderpaste performance? 2.

Re: Siemens Reliability

Electronics Forum | Fri Mar 05 15:52:03 EST 1999 | Scott Cook

| We are currently looking into purchasing a high volume, medium mix production line. We are considering several different vendors and I would like to know if current users of Siemens equipment are happy. Are the machines maintenance intensive? Ho

Paste Inspection Requirements

Electronics Forum | Wed Sep 19 15:32:24 EDT 2001 | jschake

I�ll volunteer to answer this one for Jake. In order to prove the performance and capability of the stencil printing process, I think this level of inspection detail is required. However, in a production scenario where a known printing performance

Re: Pick Place Change-overs, strengths, ages

Electronics Forum | Thu Sep 16 20:27:52 EDT 1999 | Dave F

| I have a number of hopefully easy questions: | | 1. Are there significant differences in the ease of change-overs and set-up among different equipment manufacturers? For example, are Siemens Siplace machines truly more modular than others? | 2.

Re: Pick Place Change-overs, strengths, ages

Electronics Forum | Fri Sep 17 06:07:52 EDT 1999 | Earl Moon

| | I have a number of hopefully easy questions: | | | | 1. Are there significant differences in the ease of change-overs and set-up among different equipment manufacturers? For example, are Siemens Siplace machines truly more modular than others?

Re: Pick Place Change-overs, strengths, ages

Electronics Forum | Fri Sep 17 08:35:45 EDT 1999 | Ryan

| | I have a number of hopefully easy questions: | | | | 1. Are there significant differences in the ease of change-overs and set-up among different equipment manufacturers? For example, are Siemens Siplace machines truly more modular than others?

Re: Pick Place Change-overs, strengths, ages

Electronics Forum | Fri Sep 17 11:16:11 EDT 1999 | Scott S. Snider

| I have a number of hopefully easy questions: | | 1. Are there significant differences in the ease of change-overs and set-up among different equipment manufacturers? For example, are Siemens Siplace machines truly more modular than others? There


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