Electronics Forum | Tue Nov 27 20:48:31 EST 2007 | davef
Shy: You say, "I've already done some evaluation to reduce the heigh of the glue but it fails at wave solder which cause the component to be drop/missing." Based on your evaluation, questions are: * What is the relation between component standoff an
Electronics Forum | Mon Nov 26 20:11:41 EST 2007 | shy
Yes, i'm agree with you davef but i'm not put the chipbonders onto pads. i'm put the chipbonders at the beneath component (center between both component terminals) which the idea is to hold the component during wave soldering which might cause the co
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Tue Jun 15 12:03:27 EDT 1999 | Dave F
| Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not caus
Electronics Forum | Mon Sep 13 11:23:41 EDT 1999 | Bing Feng
Hi, Recently encountered missing components problem at the SMT process. Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked the pick
Electronics Forum | Wed Mar 03 13:50:37 EST 2004 | gregp
The root cause of your problem is your placement equipment. It is not designed for continuous production during component replenishment. Feeders that can be removed, reloaded, and placed back on the machine while the machine is running (without mis
Electronics Forum | Mon Sep 13 12:31:41 EDT 1999 | Wolfgang Busko
| Hi, | | Recently encountered missing components problem at the SMT process. | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked t
Electronics Forum | Mon Sep 13 21:18:29 EDT 1999 | Dave F
| Hi, | | Recently encountered missing components problem at the SMT process. | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked t
Electronics Forum | Wed Sep 15 20:30:57 EDT 1999 | Bach Huss
| | Hi, | | | | Recently encountered missing components problem at the SMT process. | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. C
Electronics Forum | Tue Sep 14 21:56:34 EDT 1999 | KEVIN SIMPSON
| | Hi, | | | | Recently encountered missing components problem at the SMT process. | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. C
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