Electronics Forum | Thu Apr 12 13:04:47 EDT 2007 | slthomas
Handling requirements of all classifications of moisture sensitive devices is found in J-STD-033. It really isn't an issue for most parts unless they're going to reach reflow temperature again, which is unlikely unless you're removing a nearby compo
Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
Electronics Forum | Thu Sep 13 17:57:59 EDT 2001 | davef
You're correct. It is curious. Possible angles to look at are: 1 WS609 loves moisture in the air. In high humidity shops, this paste hakes-on liquid. If this is the case, you should also see slumping, resulting in fine pitch bridging, and solder
Electronics Forum | Fri Oct 06 09:25:57 EDT 2000 | Kev Head
Most places I've seen don't do anything special. But then again most places only have chip components on the bottom of their boards along with some thru-hole. The best way to find out if you are going to delaminate is to talk to the board manufactu
Electronics Forum | Thu Jul 29 12:33:38 EDT 1999 | Wolfgang Busko
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Mon Mar 01 22:24:53 EST 1999 | Dave F
| It seems to be that we have to much NaCl left on our assambled PCB's. | The flux we use is from cobar. They say it can not be from the flux... So what can be the reason, what kind of problem may occer when there is to much NaCl. | George: When so
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