Electronics Forum | Wed Dec 28 21:18:12 EST 2005 | davef
You don't TS bond gold wire to nickel [of ENIG] for the same reason that you don't TS bond gold wire to hard gold. [Nickel or maybe cobalt is used to harden soft gold.] Together nickel and gold produce unreliable bonds. Look here: * http://www.smta.
Electronics Forum | Fri Dec 08 18:59:59 EST 2006 | Jack
Re-address the link... http://www.smta.org/files/SMTAI01-Jay.pdf Look at the last page about bare board reparing..
Electronics Forum | Fri Dec 08 00:02:35 EST 2006 | Jack
Hi all, I found this article (Dealing with "the black pad defect)about reworking bare PCB with black pad symptom...Use HASL to treat black pad..Have you guys try this before?? www.smta.org/files/SMTAI01-Jay
Electronics Forum | Mon Jan 03 16:34:10 EST 2005 | davef
The main advantage if ENIG over HASL is that ENIG is flat and HASL generally is not. The main disadvanages to ENIG over HASL are: * Cost of ENIG is 1.5 - 2X higher than HASL * Selflife is less than HASL * You solder to nickel, rather than copper * E
Electronics Forum | Thu Aug 01 12:58:07 EDT 2019 | davef
Look at: * Conformal Coating 101 - https://www.smta.org/chapters/files/UpperMidwest_BTW_Conformal_Coating_June_27th_2012.pdf * IPC Conformal Coating Course - https://edge.ipc.org/course/conformal-coating * IPC-CC-830: Qualification and Performance
Electronics Forum | Wed Jul 01 13:17:39 EDT 2015 | davef
Cheryl Tulkoff and Randy Schueller do a good job summarizing the thinks on pad cratering here: http://www.smta.org/chapters/files/uppermidwest_padcratering.pdf Potential Mitigations to Pad Cratering * Board Redesign * Solder mask defined vs. non-s
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