Electronics Forum | Mon May 20 09:24:32 EDT 2013 | davef
SAC / Ni interface is the IMC (Cu, Ni)6Sn5
Electronics Forum | Mon May 20 22:13:45 EDT 2013 | ultimatejoker
So u mean it is to form the intermetallic compound which is (Cu,Ni)6Sn5?
Electronics Forum | Fri Nov 05 15:27:30 EST 1999 | Brian
What is the liquidous temp for: 95Sn/5Ag and 96.5Sn/3.5Ag thanks in advance
Electronics Forum | Fri Nov 05 15:44:50 EST 1999 | Tim Jensen
Brian, 96.5Sn/3.5Ag is eutectic at 221 C 95Sn/5Ag has a melting range of 221 - 240 C Hope that helps you out...
Electronics Forum | Thu Nov 03 13:35:46 EST 2005 | Amol
the copper forms intermetallics with tin to get Cu3Sn and Cu6Sn5. thus intermetallics formation consumes Cu and depends upon the cooling rate, faster the cooling rate, lesser the intermetallic formation
Electronics Forum | Fri Mar 10 03:16:07 EST 2006 | Slaine
Multicore make a HMP alloy liquidus at 298 degrees, Pb93Sn5Ag2.Ive used it to attatch thermocouples but they're difficult to solder as they dont wet.
Electronics Forum | Wed Sep 03 07:43:13 EDT 2008 | davef
What do you mean by a "few micron thick"? IMC thickness pre-cycling (NEMI Lead-free) * Cu3Sn: 3um [118 uin] * Cu6Sn5: 1um [40 uin]
Electronics Forum | Wed Aug 24 03:12:01 EDT 2011 | richieoreilly
Hi, The solder we use is Sn5Pb93.5Ag1.5. with a melting point of about 30 degrees.
Electronics Forum | Mon Dec 28 08:51:45 EST 2009 | jax
What solder are you talking about and what reflow method are you using? High Melt Alloys: SN96 (Sn96/Ag4 or Sn96.5/Ag3.5) - Simliar to SAC305 although normally uses Rosin based flux that can required more extensive cleaning. Pb85 (Pb85/Sb10/Sn5) -
Electronics Forum | Mon Jul 22 14:01:31 EDT 2013 | jax
HMP can mean a lot of things, although it is normally used as the generic name for one of the following alloys: Pb93.5 Ag1.5 Sn5 (296°C-301°C) Pb95 Sn5 (308°C-312°C) Pb97.5 Ag1.5 Sn1 (309°C) If you are talking abou
