Electronics Forum | Thu Jun 06 09:28:24 EDT 2002 | Hussman69
Sure do, it's from the paste that gets squeezed under your R's and C's. This paste is now on your mask and during reflow, wants to move off the mask. Unfortunatly, it follows the flux residue to the side of your component. An easy fix is to use th
Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus
| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Mon Sep 19 01:57:28 EDT 2016 | shriram
Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component). As a containment I'll give a home plate design for the compo
Electronics Forum | Mon Aug 29 11:05:10 EDT 2005 | foresiteeric
davef: I am a colleague of Sara at Foresite and we came to the conclusion that the solder balls were entrapped based on the minimal amount of information from the original question and the fact that the x-ray showed the balls and it wasn't mentioned
Electronics Forum | Wed Aug 04 16:46:40 EDT 2004 | davef
We assume this is different discussion that the discussion about "crystallized flux under BGA". Correct? Milky residue with water washing makes us think "noclean flux res that just got washed". We know what you said, but we can't help ourselves.
Electronics Forum | Sat Jan 08 11:12:49 EST 2000 | S. Evers
Hi all, Best Thing Since Sliced Bread? No doubt many of you have seen Phil Zarrow's "over-the-top" review in Circuits Assembly of the new Ersa scope, a device that allows viewing a really neat close up a side view of the component substrate interface
Electronics Forum | Fri Jul 20 13:50:22 EDT 2018 | vchauhan
This question is regarding stencil design: I am having voids under QFN TI P/N LMZ20502SILT. I have attached component pic. Signal pin is 18X16 mils. Center pads are 31 mil sq. Initially I had stencil done with one mil per side reduction on signal pad
