Electronics Forum | Thu Feb 02 10:10:20 EST 2023 | tommy_magyar
Perhaps google this, as you will find very interesting articles. For scientific explanation look up solder fatigue on Wikipedia with references added. A more in depth explanation you can find on the Digikey forum where you will find other people like
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Fri May 13 14:08:39 EDT 2011 | eezday
This appears to be black-pad and is often the result of using specs that call for gold plating that is too thick. The black pad is corrosion that is created between the gold and electroless nickel during the gold plating process. This is counter in
Electronics Forum | Fri Sep 21 10:44:34 EDT 2001 | slthomas
You can, and for small parts you probably won't see much difference between body temp. and lead temp. For QFPs or PLCCs there will be a much greater delta, though. I'd be more concerned with the small surface area you're making contact on (spherica
Electronics Forum | Fri Sep 21 21:43:16 EDT 2001 | dougk
We're used to placing the theromcouple on the solder joint and securing it with thermally-conductive UV adhesive. It's quick & easy to apply, and I've only seen a couple degrees difference from high-temp solder technique. Thoughts?
Electronics Forum | Tue Mar 23 16:20:54 EDT 2021 | grahamcooper22
Hi, just wondering are many assemblers using vacuum reflow systems, whether they be forced air based or vapour phase type ? If so, anyone seeing any negatives caused by the vacuum with regards liquid solder being 'sucked' away from the joints in the
Electronics Forum | Mon Sep 22 13:18:59 EDT 2003 | pjc
I remember reading something about that a while back. The paper said vibration created a higher percentage of voids in solder joints.
Electronics Forum | Mon Apr 07 15:22:17 EDT 2014 | garym4569
Found the issue. The footprint is incorrect. The inductor completely shields the paste from heat. Slid the inductor on the pad to expose the pad and paste, and perfect solder joint. This part was a last minute design change with a larger body.
Electronics Forum | Thu Nov 19 10:24:14 EST 1998 | Brian Co nner
Currently, I am having problems with a AMP Mictor connector at the wave process. These connectors have both SMT leads(topside) and thru-hole leads. Even though we have re-designed the board for via issues. We still see some of the SMT leads re-fl
