Electronics Forum | Wed Dec 08 19:50:34 EST 2004 | shen_zte
can anyone tell me the benifit of the solder mask onto pad(part) or pad defined by solder mask?and how to excute the SMT process ? thanks.
Electronics Forum | Fri Nov 09 16:58:30 EST 2001 | davef
Go for it!!! You were unspecific, but adding mask to a completed board could cause: * Increased paste thickness, if you have double thickness of solder mask. * Wrinkled and lifted solder mask under the component, if the solderability protection of
Electronics Forum | Fri Nov 03 15:43:20 EDT 2017 | dleeper
IPA and DI water are both very common and effective methods of cleaning PCBAs. http://www.zestron.com/sa/cleaning-applications/smt-electronic-cleaning/pcba-cleaning/aqueous-cleaning.html http://blog.gotopac.com/2010/11/18/ipa-as-a-universal-cleaner
Electronics Forum | Fri Dec 01 14:12:50 EST 2000 | Jim M.
My company currently uses water soluble paste for our SMT process. We were having trouble retaining hot water in our in line, closed loop DI cleaner. The cleaner kept shutting down when the water temp. dropped below 125C. As a result, the conveyor
Electronics Forum | Mon Sep 13 18:34:31 EDT 2004 | russ
Use Water soluble if you can, if not I would try the Indium SMQ NC paste, this residue stays soft. I would also change ICT probes to the "drill type". Russ
Electronics Forum | Fri Sep 10 09:39:32 EDT 2004 | Bryan Sherh
Dears, I've a board with OSP surface finish,and I planned to print solder paste on the test pad for easy ICT, because the probe can't reach the OSP covered pad.But to my surprise,after reflow there's much flux residue on top of test pad(or solder) an
Electronics Forum | Wed Oct 27 19:50:59 EDT 1999 | chris
Hi What is the possible cause of non-wetting of solder paste to the gold land pad. What we observed in the surface of the non-wet pad is an organic FM, and using FTIR we found out that it is a flux. It is possible that the cause of non-wetting is
Electronics Forum | Tue Sep 25 12:49:58 EDT 2001 | Hussman
Been there - done that. Makes a mess on that 2nd reflow process- doesn't it!?!?!? This is caused by design. If the open via is located in the land area, it will flow thru the via and cause pumps on the opposite side. You can have your vias filled
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Thu Oct 28 09:25:35 EDT 1999 | Dave F
Chris: Typical non-wetting causes are: * Poorly controlled soldering process * Incorrect material * Surface contamination * Insufficient preheat * Misapplied solder mask * Shadowing Without intending to insult you, all of the causes of non-w
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