Electronics Forum | Fri Jan 29 16:17:13 EST 2021 | donnie15
The impact is low on larger pitches and pad sizes. as things get to the .4mm pitch the pad differences start affect your ball size and yields. The trace size going into the pads and the solder mask relief can cause some odd shaped pads with signif
Electronics Forum | Mon Nov 08 12:47:52 EST 2004 | clampron
Good Day Everyone, I have a BGA rework that has some chipped/damaged solder mask that will need to be repaired prior to BGA replacement. I was wondering what materials are being used in the industry for this type of application. Any help would be g
Electronics Forum | Mon Nov 08 15:10:52 EST 2004 | russ
We usually get some mask material from our board house. It cures with heat so it works really well in our applications. Be wary of the "overcoat pens" they don't seem to hold up under heat and thre solder will flow right underneath it during BGA a
Electronics Forum | Mon Nov 08 17:47:58 EST 2004 | davef
Russ: On "usually get some mask material from our board house. It cures with heat so it works really well in our applications.": We're unsure about the type of mask that you are using, but be careful [we used to do this, also]: * Final cure of the L
Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer
| | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit
Electronics Forum | Mon Aug 16 04:34:54 EDT 1999 | Earl Moon
| | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with
Electronics Forum | Mon Aug 16 07:54:05 EDT 1999 | Peter Barton
| | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact w
Electronics Forum | Wed Aug 18 21:03:41 EDT 1999 | Dave F
| | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact
Electronics Forum | Fri Aug 20 03:19:22 EDT 1999 | PeterB
| | | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate conta
Electronics Forum | Mon May 22 17:14:16 EDT 2000 | Justin Medernach
Hi All, I'm looking for companies who sell in-line solder mask applicators capable of dispensing peelable as well as water soluble mask formulations. Could anyone provide me with some names, please. If this is the wrong forum for this question, I d
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