Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Fri Aug 22 00:25:20 EDT 2003 | mantis
Kenny, Out of curisoty why do you need to paste the vias.Is it due to contact reliability at test.Can these vias not be soldered during wave process (if any).Can the Style of probe used in the ICT test fixture not be changed to accomodate these unsol
Electronics Forum | Mon Feb 10 10:23:53 EST 2020 | emeto
Solder paste has stencil life time - if you go over it means you should change it. If you print boards in front and keep them for too long before reflow, the flux is still evaporating, so you are not mitigating the risk. Paste also likes room tempera
Electronics Forum | Thu Aug 19 15:49:05 EDT 2004 | pjc
Hi Erhard, Go to http://www.globalstencil.com They are the stencil firm that worked with MPM for developing technology for printing with thick stencils that are milled out on the bottom to account for existing components on the top side of a PC boa
Electronics Forum | Thu Oct 27 00:45:41 EDT 2005 | pavel_murtishev
Good morning, I can recommend to use solder paste softeners, which can prepare solder paste for printing process. Softeners rise paste temperature by means of pseudo-planetary motion. Therefore, solder paste reaches room temperature during only 15
Electronics Forum | Thu Aug 21 23:35:20 EDT 2003 | kennyg
For ICT purposes I may need to print solder paste on 0.015" test vias. No-clean is not an option for this assembly and OA seems the only choice. Can flux be safely removed from inside the via from the other side during a standard water wash process
Electronics Forum | Tue Aug 26 21:12:24 EDT 2003 | iman
depends if your water wash process is manual or automation? important is the water residue inside the via holes is adequately blown out. As long as the water-flux residue is out, testing down the line should not be a issue, at least from theory and o
Electronics Forum | Sun May 23 07:13:56 EDT 1999 | Scott Cook
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
Electronics Forum | Thu Jun 21 15:52:37 EDT 2001 | ohboy
Hi Ian- check out the ipc.org technet forum archives, there was recently a big thread about this very subject. There are some definite advantages in some situations to dispensing paste. Bill
