Electronics Forum | Sun Nov 16 09:02:47 EST 2008 | davef
While we're unfamiliar with Swisstone, we accept: * Techspray Solder-Wik * Chemtronics Soder-Wick * NTE Solder Wick All of these [and Swisstone] look basically the same. We wonder if maybe they're all made by the same source and branded differently
Electronics Forum | Thu Nov 13 07:57:36 EST 2008 | alien
What type of solder wick do you use for cleaning up QFP pads after desoldering ? Many brands only wick well at the end, but not when laid flat over the pads. Swisstone brand (made in US) works best for me, but the suppliers seems to play hard to ge
Electronics Forum | Mon Oct 22 10:51:48 EDT 2007 | davef
You say, "we have encountered solder wicking on components ..." We expect to see wicking on solder connections. Maybe we're just using different terminology. Please describe the problem that you're seeing.
Electronics Forum | Mon Oct 22 05:04:08 EDT 2007 | jkhiew
Hi, Recently we have encountered solder wicking on components termination (total of 13 pcs of components on one pcb)with Ag/Pd finishes during lead-free reflow soldering. The pcb is LF HASL surface finish and LF solder paste composition is SAC305.We
Electronics Forum | Tue Oct 23 03:57:39 EDT 2007 | jkhiew
Thanks Dave. But I do not understand why the solder being wicking away by the component itself. Does Ag/Pd finishes has stronger wettability than LF HASL finishes ? Rgds
Electronics Forum | Mon Oct 22 20:41:32 EDT 2007 | jkhiew
Hi Dave, The solder has tended to wet the component termination of Ag/Pd (chip capacitor) but has not wetted the pads, whereas the solder has wetted both termination & pads when using Ag/Ni/Sn finishes. Thks
Electronics Forum | Tue Oct 23 07:03:52 EDT 2007 | davef
We're not really sure. Usually when solder leaves the pads and wicks-up a component lead, it means the component lead is much warmer than the pad on the board. This is the direction we would have taken this if we hadn't taken the AgPd / conductive e
Electronics Forum | Mon Oct 22 21:34:36 EDT 2007 | davef
Double check on this, but we have this little voice in our heads telling us that your AgPd termination is intended for conductive adhesive applications. Check with your component supplier. We recall a thread on SMTnet [ http://www.smtnet.com/forums
Electronics Forum | Mon Aug 23 05:00:20 EDT 2004 | Jefflee
Hi, Would like to know if the design of the Bga pad is depth and after used solder wick and soldering iron to remove the the damage solder ball,there are still remaining solder inside the pad.Is there any method to remove the remaining solder. Thank
Electronics Forum | Tue Jul 17 15:13:53 EDT 2001 | mparker
Dave - I agree that the U shape for QFP's sounds a bit whacked, for the reasons you state. It may work OK for larger pitchs but then again there are a myriad of fixes that work before resorting to U shapes. With the U shape removing paste from under
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