Electronics Forum | Tue Oct 05 10:48:46 EDT 1999 | Frank Fossett
I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via's u
Electronics Forum | Tue Oct 05 10:13:48 EDT 1999 | Frank Fossett
I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer wants to use an .035 pad with a .012 dia. hole, there are no via's under the zero clea
Electronics Forum | Tue Oct 05 12:42:43 EDT 1999 | Chris May
| I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via's
Electronics Forum | Wed Oct 06 04:23:09 EDT 1999 | Brian
| | I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via
Electronics Forum | Tue Nov 13 09:32:28 EST 2007 | kpm135
For the simple fact that the via in the middle of the pad causes the solder to wick into the hole instead of flowing out across the pad and part. Thus cause insufficient solder issues.
Electronics Forum | Tue Nov 20 12:31:12 EST 2007 | kelz
In my past experience, having via's under or attached to SMD lands produces risk. Solder will not consistently wick the same if it is being drawn into a via. This has also caused issues from solder wetting through the via to the other side causing a
Electronics Forum | Tue Nov 13 09:36:18 EST 2007 | rgduval
From a manufacturing standpoint, this isn't very nice. Vias will tend to wick solder away from the pad, resulting in insuficient solder joints, which require touch-up. The amount of times any solder joint is reheated should be minimized, as extra h
Electronics Forum | Fri Aug 16 10:00:03 EDT 2002 | davef
You have a very bad situation. It�s tough for the gas, flux material, er whatever to escape when the BGA is sitting on top of it and the blind via is blocking it from the other side. Obviously the vias should have been: * Placed on the edge of the
Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef
There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio
Electronics Forum | Mon Jan 18 20:51:29 EST 1999 | Dave F
| Can anyone recommend ways of reducing damage to solder masks ... a new wick perhaps. I find that using standard wicks the imposed damage is un-acceptable. | | Also any good links on the subject of bga rework would be really appreciated | | in ear
.gif)
