Electronics Forum | Tue Jul 20 08:32:37 EDT 1999 | Dave F
| Could someone please tell me if it is possible that erroneous 'leakage current' readings in an instrument could be inheritated by the type, design and fabrication of the PCB itself, if so then where could I find information relating to this subject
Electronics Forum | Sun Aug 31 07:13:13 EDT 2008 | allan99
All that they are telling is important (variants in the process), what you can do in a fast way is: change the component for a new one (date of manufacture / other supply - if you have); change the component (test - same package but other specificati
Electronics Forum | Wed Sep 10 17:12:55 EDT 2008 | gregoryyork
I dont know about analysis on boards it is OK as long as the people carrying it out know how to interogate the answers.I worked on a problem just last week where an analysis house in China tested the resist then the pads and found on both surfaces C
Electronics Forum | Wed Sep 10 14:39:30 EDT 2008 | vladig
No, we didn't do the test you mentioned, but did EDS on the joints and didn't see carbon their (which would indicate the presence of any organic-based contaminant). For the customer the issue was closed and passed to the board shop. We did work with
Electronics Forum | Wed Sep 10 14:14:03 EDT 2008 | gregoryyork
Yes why did the Electroless Nickel layer split this is the ROOT cause. My guess is still that the resist was slightly miss registered over the copper and therefore poor adhesion of the Nickel ensued OR like I said originally the resist had contaminat
Electronics Forum | Mon Apr 19 10:52:05 EDT 2010 | esca
Hi, if you want to verify the gold contamination, is mandatory to use the XPS and FTIR analysis, but is difficult think about a gold contamination from 3 different manufacturers. Do you have cleaned the PCBs after an erroneous screen process ? If no
Electronics Forum | Wed Sep 22 14:22:54 EDT 2021 | oclsc
Hi Forum. Is there anyone who can tell if an empty PCB with no SMD components mounted and HAL surface will get a less solderability after been running through reflow (convection). Eg. when testing empty PCB with temperture data logger. Regards Ole
Electronics Forum | Tue Nov 02 08:24:31 EST 2004 | bpevear
We are looking to have some PCBs (bare and assembled) independently tested for cleanliness. Our mfg facility is in Malaysia. Can anyone recommend a test house capable of testing to IPC-6012, IPC-5701, etc.
Electronics Forum | Tue Nov 11 02:36:56 EST 2003 | Henry Lee
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca
Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint
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