Electronics Forum | Thu Jan 29 15:27:54 EST 2015 | markhoch
I agree with SWAG on this. Nano Coatings make a big difference on paste release. I found when placed on the topside of the stencil, it also helps to reduce stencil wear, though others complained that it affected the solder roll, so most stencil house
Electronics Forum | Wed Nov 05 15:47:57 EST 2014 | pnguyvu
Hi Bill, Contact Steve Yen with USA STENCILS INC. He'll help you out. He might need to know stencil thickness and type of solder paste, his contact as below. Steve@usastencils.com 714-636-6211
Electronics Forum | Fri Sep 21 15:27:34 EDT 2018 | stv_herring
Peter, Based on the images, it looks the HASL is too thin. I have seen this a few times when the pcb supplier uses too aggressive of a process to remove the solder. This can lead to oxidation of the underlying copper. An XRF of a pad that won't take
Electronics Forum | Fri Aug 24 12:24:35 EDT 2018 | davef
Could be ... Consider this: The LED and the BIG pad reflowed before the small pad. The superior force of the solder on the BIG pad pulled the LED over and the LED took the solder on the little pad along with it. Try this: Print paste on a board. No
Electronics Forum | Thu Jan 08 15:03:40 EST 2004 | dwzeek
We have an ongoing problem with our QFP144 packages soldering. It has not received much attention until late due to some customer failures. Most of the failures would show up in ESS testing and be repaired. The failure rate is about 2 in 1000 parts f
Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek
This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet
Electronics Forum | Wed Nov 05 18:24:11 EST 2014 | wbrenner
Thanks for the contact info . I have the DEK process eng coming in.
Electronics Forum | Mon Nov 10 09:59:01 EST 2014 | cyber_wolf
Dek Nano coating = Snake oil
Electronics Forum | Fri Oct 31 14:09:07 EDT 2014 | wbrenner
Having a problem with a DEK printer. In the back to front motion, getting poor ramdom paste volume on micro BGA pads. Other BGA 1 mm pads are fine. The front to back motion is fine. Any throufghts on this directional issue. Ran ~200 panels no pr
Electronics Forum | Mon Nov 03 08:39:30 EST 2014 | emeto
Looks like you did everything right. Clean and check carefully the stencil for damage close to the part you are having problem with. If not both of your squeegees should be damaged on the same spot.
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