Electronics Forum | Wed Oct 14 10:04:02 EDT 1998 | Dr. Kantesh Doss, Siemens Energy & Automation, Inc.
Sanjay: Keys to successful adhesive printing are: 1. Understanding the flow behavior of the adhesive under constant shear stress 2. Stencil design, i.e. stencil aperture opening 3. PWB Footprint 4. Stencil printing parameters Optimizing all these fac
Electronics Forum | Fri Feb 19 12:56:34 EST 1999 | Tony A
| Please could you suggest a recommended aperture sizes for | printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated. | Mark, talk to Irene Horvath at I Source Technical Services, Inc. Her
Electronics Forum | Fri Feb 19 03:57:48 EST 1999 | Mark Alder
Please could you suggest a recommended aperture sizes for printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated.
Electronics Forum | Mon Feb 22 12:04:15 EST 1999 | Dave F
| Please could you suggest a recommended aperture sizes for | printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated. | Mark: About the only rule of printing adhesives is: Keep it off the
Electronics Forum | Wed Oct 11 13:40:20 EDT 2023 | proceng1
Agreed. Your "leads" are fairly small compared to the PAD area, so you leave your part lots of room to "stretch it's legs". One thing that I have trouble communicating to my operators is that placement does not have to be perfect, and neither does t
Electronics Forum | Fri Mar 09 15:13:49 EST 2012 | davef
Care must be taken to not apply an excess of material, as the adhesive will flow under the device during placement and curing, and could cause a short. Printer setup: * Don't worry about stencil thickness. A wide range of stencil thicknesses (typic
Electronics Forum | Sat Aug 07 11:10:03 EDT 1999 | JohnW
| Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. | My regular stencil manufacturer recommend the following: | Thickness: 8 mils | 0805 opening: Oblong
Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Fri Sep 17 09:31:33 EDT 2004 | C Lampron
Hi Chris, It sounds like you may have to go with your idea of a relief cut into the stencil. Are there any components that need to be printed in close proximity? Is this a high volume?I used to work at a flex house and we had a similar situation. We
Electronics Forum | Thu Sep 16 07:07:34 EDT 2004 | C Lampron
Hello Chris, "It sticks up about 3/8" or so above the surface of the board." Is this over the ridgid portion of the PCB or in between? Is it possible to create a support fixture for printing that has relief that will allow the flex to bow downward i
