Electronics Forum | Wed Oct 09 08:44:05 EDT 2002 | apg
Dear colleagues. I ask you to prompt me about necessity of drawing pastes through a stensil at the soldering micro BGA with step between leeds 1 mm and 0,8 mm or uses only a flux for this purpose. And what most suitable paste for the soldering of su
Electronics Forum | Thu Jul 10 02:49:34 EDT 2003 | emeto
Hi! One technique: 1. Remove all balls 2.Make a mask(stensil)for reballing.The holes of the mask must be 0.8-0.9 the size of the pads. 3. Reball chips 4. Reflow chips Good luck
Electronics Forum | Sat Jan 29 21:18:35 EST 2022 | reem1993
Hi everyone, In the assembly of a component of the size of 0201 which Position Accuracy is recommend to use? Stensil thickness? and Solderpaste Type? BR,
Electronics Forum | Sun Feb 06 12:03:32 EST 2005 | dhanashekar
can some one give me some suggestion to solve the problem. we are using cooksun/alphametal rma9086 paste for our screenprinting. after the reflow we see lot of solder ball on the board. we have maintained the exact profile given by the manufacurer. w
Electronics Forum | Sun Feb 06 12:04:06 EST 2005 | ddhanashekar
can some one give me some suggestion to solve the problem. we are using cooksun/alphametal rma9086 paste for our screenprinting. after the reflow we see lot of solder ball on the board. we have maintained the exact profile given by the manufacurer. w
Electronics Forum | Thu Oct 26 05:26:53 EDT 2000 | Mika Pirttimaa
Well, Yes those measurements are required as long as your process is not in control. It is true that quality people easily demand too much and are too strickt in the areas that are not so important. Height of the pad is one of them, it is not very in
Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc
Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with
Electronics Forum | Sat Feb 10 20:08:25 EST 2007 | colormaker
I just started a design where I will be placeing smt parts on both side of PCB. 50 parts on top side ranging from 0602 to SOIC8 and 4 SOIC LED's on bottom. How can I assemble with parts on both sides ? I have P&P,stensil printer, relfow and solder w
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