Electronics Forum | Sun Jun 06 09:20:03 EDT 2004 | michaeljm
My department and I have been working with immersion silver on and off for about four years and we have compiled quite a bit of data for the Alpha and MacDermid immersion silver chemistries. We have not encountered any assembly or storage related is
Electronics Forum | Wed Oct 06 04:11:35 EDT 2010 | grahamcooper22
I've done minimal research to this point and > understand my issue with solder on the double > sided boards is due to oxidation that occures on > the unpopulated pads when the board makes its > first trip through the reflow oven. > > We did run
Electronics Forum | Wed Sep 03 16:59:13 EDT 2008 | glennster
At a former employer we required HASL thicknes to be a minimum of 0.75 micron (30 microinches), as measured at the thinnest point on any given pad. This would generally assure a minimum 1 year solderability shelf life. Usually when we saw a soldera
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Tue Jan 19 11:12:41 EST 1999 | Dave F
| | | | | Folk's, | | | | | | | | | | I'm looking for information of how long you cna store a gold finish PCB before building it. I know there are problems with the gold disappearing into the underlying nickle over time / temperature etc but exactly
Electronics Forum | Tue Aug 17 14:08:50 EDT 1999 | Glenn Robertson
| We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give us
Electronics Forum | Sun Jun 20 16:58:31 EDT 1999 | Chrys Shea
| Has there anyone bold enough to try this in their shops? My cubemate just got through telling me that at his last shop, they had bare copper boards (no HASL, no OSP, no nothing), with minimal solderability problems. | Is your cubemate the same gu
Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach
| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and
Electronics Forum | Mon Apr 26 11:04:53 EDT 1999 | Dave F
| | Earl said, in essence: | | | | | Justin is absolutely right ... | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those coatings chemi
Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
