Electronics Forum | Tue Dec 14 12:00:34 EST 1999 | Kris Wiederhold
We recently reduced our standard aperture reduction to aid in the reduction of solder on gold defects. Since this reduction in aperture size, we have been experiencing exposed copper at the end of the component pads. The heel and toe joints are per
Electronics Forum | Wed May 29 17:17:49 EDT 2002 | wilcoxito
As far as aperture dimensions go, I found a technical note written by Micron that recommends using "square apertures with sides equal in length to the diameter of the PCB pad. The corners of the square should also be slightly rounded, and the apertu
Electronics Forum | Fri Feb 06 10:23:15 EST 2004 | pjc
Hi Stefan, We had a good operator. He adjusted the heat and pressure to get it right on the used tape. We re-used tape from Samsumg & Toshiba TSOP44, QFP64 ASIC as well as a connector on 56mm tape when they came in tray. We also did on many SOICs of
Electronics Forum | Thu Jun 09 09:08:09 EDT 2005 | russ
It's normal for us when we review design. We have found that in the Y axis we need .015" whereas in the X axis we can use .005" spacing. this relates to our nozzle size vs. pickup skew etc... This wouldn't apply if there are parts taller than XXX
Electronics Forum | Wed Feb 27 04:23:13 EST 2008 | fujillews
Hi It is best to fit the VGA camera for 0201 parts make sure your software is high enough..above v1.33 although you can place without but no so good. 0.4mm tapered nozzles are best. 0201 feeder the locator base in increased by aprox 0.3mm and the ind
Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc
IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l
Electronics Forum | Tue Sep 21 13:17:29 EDT 1999 | Dave F
snip | I've often been tempted to try something a little different when specifying QFP apertures. Like, for example, using long, tapered triangular apertures arranged in alternating directions. The objective being, get the maximum amount of paste do
Electronics Forum | Thu Aug 26 10:28:07 EDT 1999 | Stuart Adams
What are the key steps to achieving high yield with CSP ??? (We are trying qualify vendors for volume fab/assembly of some products which use several CSP devices on each side of the board. (Some with 0.5mm ball pitch)) Looking through the forum I
Electronics Forum | Fri Aug 27 13:24:19 EDT 1999 | swsng
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Fri Sep 26 11:38:14 EDT 2003 | slthomas
I'm not sure if I'll get to this next week, and since I'm gone after Tuesday I thought I'd get this out of the way. The Global Economy has gotten the best of this guy. I don't know where I'll land when the dust settles, but you can be sure that if I
