Electronics Forum | Wed May 11 20:25:38 EDT 2022 | mikevb
Thanks. Yes, I replaced the ffx board with a new one and made sure everything is cleaned. I did check the flex cable connect as I removed all of that to test continuity between everything. It all checked out continuity wise. I also tried to disable t
Electronics Forum | Fri Aug 13 09:09:11 EDT 2004 | davef
Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * IPC EIA J-STD-003A - Solderability Tests for Printed Boards Not intending to insult you, but terms used to descr
Electronics Forum | Mon Jan 15 11:21:48 EST 2007 | davef
Contractor mantra: * Profile is good * Boards are bad On profiles, the key question is: where did you take the profile? We�d guess cracked connections are giving the intermittent test results when pressing on the components. You use acoustic micro
Electronics Forum | Fri Sep 03 11:45:15 EDT 2004 | rlackey
Hi Ken, I know this doesn't help in the immediate timescale, but isn't avoidance the best form? can you trace the cracking to a process issue (Solder profile, shock damage, handling damage, probe/ATE damage)or a chip cap manufacturing fault? I can'
Electronics Forum | Thu Sep 30 12:02:20 EDT 1999 | Wolfgang Busko
| I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | What is the best way to achi
Electronics Forum | Tue Jul 25 03:10:05 EDT 2006 | reypal
If your Test tech able to analyze and tell you which exact ball/location is the problem, you may send it for cross section analysis and see how the solder connection behaves. also pls check your ESD implementation.
Electronics Forum | Fri May 28 03:31:56 EDT 2021 | acouto
Thanks for helping, during the opening of the head housing, I realized that a connector responsible for the vision was slightly poorly connected and that could be the cause of the IPS problem. Is there any way to test the head on fuji head cleaning e
Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef
Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ
Electronics Forum | Tue Oct 02 22:13:56 EDT 2001 | davef
IPC-D-356 is a data transfer language developed by the IPC to replace Gerber. It is a far more intelligent form of physical definition for PCB/PWB. The only segment of the language that seems to have developed any market support is the physical netl
Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F
Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.
