Electronics Forum | Sat Oct 03 12:33:02 EDT 2015 | rushpcbuk
Electronic digital methods of determining unsoldered leads/pins Unsoldered lead or pins in a PCB or any other electronic components leads to open circuits or faulty electrical connections thus the device does not operate. Typical inspection method
Electronics Forum | Mon Feb 12 11:13:12 EST 2007 | davef
Q1. If I go to the Pb-free solder paste, is it necessary that I have to change my reflow oven OR just by changing with respect to solder paste specification, I can reach my goal? A1. It depends on your current oven. Some ovens can meet the higher t
Electronics Forum | Thu Aug 24 13:51:24 EDT 2000 | Dr. Ning-Cheng Lee
Low temperature aggravates the mismatch in thermal expansion between solder and parts and between components and boards, therefore can induce earlier failure. The low temperature screening test should not be as effective when used on soft solders su
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
Electronics Forum | Wed May 02 11:00:46 EDT 2007 | bartlozie
to get a 0-defect layout, OEM and CM have to work together, If you know what connections (balls) are the problem ones, let me know, and send me the gerber-layers + solderpaste layer, so we can see if the problem is design related or if you CM realy
Electronics Forum | Fri Aug 31 10:49:30 EDT 2007 | erokc
OK, I've found out more on the disposable cartridge. It is made by Siemens. There are four in the series. One of the part numbers is 3C0600002. It has colored resin and changes color to indicate depletion. Has hose connects each end. I will try
Electronics Forum | Mon Sep 14 22:59:42 EDT 2020 | kylet
Looking to power up this board with 3v coin battery. I've tested this board with it and it works but to solder this on or make something that has clips for the attachment to power this up. Positive and negative connections are the circles on the inne
Electronics Forum | Mon May 09 19:27:19 EDT 2022 | mikevb
Thanks for the response. Yes, the z motor initializes in the service program just fine. It moves and reads a position. Also in the service program, I try to test the z force sensor and it gives me the same error - no z indicator at all. All cables ar
Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
Electronics Forum | Wed Jan 03 09:59:52 EST 2007 | Jim
Hi, I was looking for information on failure rates for BGA components. I am analyzing our BGA rework rates and find it difficult to define a root cause when a remove and replace of the BGA component corrects the test errors. Inspection prior to re
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