Electronics Forum | Sat Aug 04 07:44:25 EDT 2007 | davef
Thermal cycle* * Requirements for and troubleshooting of poor barrel fill => Hole fill
Electronics Forum | Fri Oct 25 08:42:55 EDT 2024 | linux
Bottom side first, use same temp setting both sides.
Electronics Forum | Fri Oct 25 10:20:00 EDT 2024 | pawantanwar
Reflow bottom side first, reduce heat slightly for second reflow.
Electronics Forum | Fri Oct 25 21:41:47 EDT 2024 | auriga2001
You could try using a water-soluble component masking to hold the big parts in place.
Electronics Forum | Wed Oct 30 08:33:57 EDT 2024 | klauss
what you mean by 'edge pin'?
Electronics Forum | Wed Oct 30 10:38:34 EDT 2024 | dontfeedphils
Edge pin conveyor = normal conveyor where the PCBA is held on the edges by a few mm.
Electronics Forum | Sat May 20 06:49:08 EDT 2000 | dave
I'm studying electronics at Manchester and I'm building a two station intercom based on an lm386. I have all the components to build it, but could do with some in depth technical imformation to impress my lecturers when I'm explaining how it works. P
Electronics Forum | Sat Aug 04 03:39:39 EDT 2007 | ahdo
Good day, can i seek an advice regarding wave soldering. Will it be advisable to reload the board two times to improve its barrel fill volume? If yes, what is the maximum number of times we can repeat wave soldering on the same board. If no, what
Electronics Forum | Thu Oct 24 19:09:43 EDT 2024 | peterm
I guess if anything 2nd side would need more heat since more mass, but if same as first side works, go for it. And agree, as long as there is rails the BGA should stay put.
Electronics Forum | Fri Oct 25 23:24:09 EDT 2024 | dontfeedphils
If you have an edge pin conveyor oven and a good profile then you'll be fine, really shouldn't be a problem.
winsouce.jpg)
