Electronics Forum | Tue Dec 17 05:58:36 EST 2019 | robl
We had a customer who used XRF to determine the thickness of the "tinned" layer of components - sort of what is briefly mentioned in Bob Klenke's SMTA paper - http://www.circuitinsight.com/pdf/Solderability_Testing_Protocols_Component_Re-Tinning_Me
Electronics Forum | Mon Nov 02 16:24:01 EST 2009 | cab
Au measured out( using XRF)at 55-75micro-inches. Within spec, per out QA dept.
Electronics Forum | Tue Jun 28 19:56:59 EDT 2005 | davef
Matt: Yes, if the gold was really thick, it could appear like your pictures. In measuring gold plating thickness, we'd want to use xray fluorescence [XRF]. For alternatives, look here: http://www.pfonline.com/articles/pfd0027.html
Electronics Forum | Mon Mar 21 08:46:05 EST 2005 | GS
Hello Gents, Many thanks Davef for your always helpful informations. I have a question, pls, related to : which kind of Test Method are they going to be used to perform analysis (Rohs Compliance verification tests) on EEE in order to find out oncen
Electronics Forum | Wed Apr 02 15:55:04 EDT 2008 | boardhouse
See if you can find someone with an XRF machine or talk to your Current Board house they probably have this equiptment if they run ENIG or Silver finishes. I would stop in with some boards your having issues with and have them measure the thickness.
Electronics Forum | Tue Dec 13 12:46:15 EST 2005 | Slaine
We came across a manufacturer selling us a part that they Classed as RoHS compliant. On further investigations the part was found to contain lead, we use an XRF. The content was over 85% so was exempt and therfor compliant(HMP solder), until we solde
Electronics Forum | Fri Oct 28 09:53:46 EDT 2005 | Amol
Hi, Is anyone out there already testing components from their suppliers for: 1. to determine if the components vendors are slipping LF finish components without notifying the end user so, eventually these end up in a leaded assembly for a exempt pr
Electronics Forum | Thu Dec 10 12:12:40 EST 2020 | robl
Yep, done it previously with a multipot machine. Using with wirefeed to top up the pots means you only have a contamintion risk when you fit a new top up reel. Used separate nozzles for both, but theoretically using titanium nozzles would mean no c
Electronics Forum | Wed Oct 10 14:21:04 EDT 2007 | petep
We have done the Green Framed Stencils for an added $50.00 per, then got smart and went to green polyester on RoHS / Lead Free Stencils at no added cost. Dedicated Stencil blades and holders green of course) as well as Green Static mats on dedicated
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
