Electronics Forum | Thu Jan 12 14:17:07 EST 2012 | blnorman
How are the vias failing? Barrel crack?
Electronics Forum | Mon Sep 15 06:14:49 EDT 2008 | milas
Hi Has anyone experienced laminateand BGA cracking on ENIG finish boards built using a lead free process? The laminate is cracked directly underneath the pad where the solder joint has cracked. We have confirmed the cracking via Microsectioning. We
Electronics Forum | Tue Jan 17 12:06:12 EST 2012 | cobham1
The via's are cracking which then is causing all kinds of problems.
Electronics Forum | Fri Jan 13 13:22:34 EST 2012 | mosborne1
I would recommend that you turn toward your PCB supplier probably China and talk to them. You should always bake your boards if this occurs. If you purchase them form a trusted source you should store them in a McDry until you use them if possible. I
Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie
Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when
Electronics Forum | Thu Sep 02 15:51:15 EDT 2004 | cburress
All: IPC does not directly state any criteria for physical characteristics of what a filled via should look like when embedded within a surface mount component's pad. I am using several of these in my design, and have received PCBs that exhibi
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Sun Dec 15 22:31:43 EST 2002 | craigj
Has anyone heard of vias cracking (barrel from pad) when being wave soldered. Was told this was a big problem by contract pcb designer, he always tent vias because of this. The reason was that the solder filling the vias caused stressing and then sep
Electronics Forum | Wed Jan 06 09:38:59 EST 2010 | lynn_norman
Via failure could be caused by cracks in the barrel, or thin plating, or fractures in the traces leading to the vias, . X-ray analysis could pick up a fractured trace and cross-sectioning of the vias could pick up the cracks and thin plating. Secon
Electronics Forum | Fri Aug 06 07:16:36 EDT 2004 | davef
When moisture outgasses through plating, it continues through the molten solder, causing a meak solder connection. There's another issue with thin plating that we haven't focused on in this thread. If plating is thin, the stress on the barrel of a
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