Electronics Forum | Fri Mar 02 08:52:20 EST 2001 | markkrmp
Are your voids looking like blow holes also? Is this only occurring on the solder joints of the Thru Hole components and Via's? Or does this happen on SMD pads? My experience is that we have seen this but only with some of our older PCB's which are
Electronics Forum | Thu Mar 01 11:43:08 EST 2001 | dason_c
Not enough info, when you say no clean flux, is it for wave soldering process, please provide more detail, SMT or wave, is it all the joint which you find the void? Rgds
Electronics Forum | Sat Sep 09 08:21:36 EDT 2000 | Sal
guys Currently experienced this problem on a product which had been running satifactorily for a period of time. No process changes were made, The problem was highlighted when after ICT when the boards were loaded in to the stress chamber, after the
Electronics Forum | Tue Nov 13 12:25:12 EST 2007 | gradloff
I have a thick board with ground planes that will be soldered by hand with a mildly active solder/flux. X-ray confirmed that solder was added to the top of the joint causing a void between the bottom and top solder joint. Other than the mildly acti
Electronics Forum | Wed Nov 14 10:51:34 EST 2007 | mumtaz
Yes. Baking boards is best. Hitting the hamer on the head!
Electronics Forum | Wed Nov 14 01:18:20 EST 2007 | reypal
How about your bare pcb handling? do you stuff smd component prior hand soldering? you can try to bake the pcb and then see if this problem still exist.
Electronics Forum | Tue Nov 13 21:59:42 EST 2007 | davef
This processes has the potential to cause barrel cracking and pad lifting, because the heating is very hot [troop crank-up the volume on their iron when they see thick boards] for a relatively small area on one side of the board. What do we suggest
Electronics Forum | Wed Oct 30 16:05:08 EST 2002 | msimkin
Hi, I have received a report form a board supplier, analysing the reuslts form non wetting problems we have been expereincing with their boards. I assumed it was due to the gold layer being too thin, thus allowing the nicklel layer to be exposed and
Electronics Forum | Tue Jul 02 07:11:31 EDT 2002 | davef
There is nothing inherently wrong with voids in solder connections. They: * Do indicate that the reflow soldering process is not well controlled. * Can comprise the strength of the solder connection. Look here: http://www.smtinfocus.com/smt_failure
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
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