Electronics Forum | Sun Feb 05 17:44:47 EST 2017 | spoiltforchoice
Printer->Paste Inspection(which might be a feature of the printer)->High speed placer (for all the little parts)->Accurate Placer(for your BGA Processor,RAM,eMMC and big things that don't fit in the high speed)->Reflow oven->AOI->PCB stacker All of t
Electronics Forum | Wed Jan 12 11:50:38 EST 2000 | Larry
I'm about to start building an ENTEK coated board for the first time. This board is a double sided board and I will be using Kester R598 water soluble paste. I searched the archives and read about watching my profile to ensure my flux doesn't burn of
Electronics Forum | Mon May 13 10:37:56 EDT 2002 | fmonette
The other important issue relates to moisture sensitive devices (MSD). If you have MSDs on the first side, you need to track the remaining floor life of the components on the partially assembled boards between the first and second reflow. Contrary to
Electronics Forum | Thu Oct 28 11:50:11 EDT 2010 | phase1
We are having a little trouble with what appears to be a crystalization between our fine pitch parts. The problem appears after a a thourough wash of the pcb when dry. It looks like lead wiskers/haze between the joints.We are using water soluable lea
Electronics Forum | Sat Apr 21 08:26:57 EDT 2007 | Cmiller
Has anyone experienced a problem with conformal coating adhesion to IS-410 boards? We are having problems with one suppliers boards. IS-410 boards from other suppliers are fine and all FR-4 boards that I have looked at are fine. We are using Conap
Electronics Forum | Thu Jul 20 15:37:53 EDT 2000 | Tekguy2000
These parts are flat chip resistor arrays that have 4 end terminations on each side. It looks liek an IC but is typically in an 0805 and 1206 package type with convex terminations. .031" pitch from termination to termination and .011" spacing between
Electronics Forum | Sat Jun 22 21:06:27 EDT 2002 | jersbo
I agree with PJC.. The mention of 2 QFPs to wave = more than likely rework to remove bridges and a potential to scrap the board, 25mil isnt as bad as 20 or less.. but the potential is still very real.$$$$$$ reflow/reflow is my 2 cents with the possib
Electronics Forum | Tue Jul 24 17:15:13 EDT 2007 | blnorman
Unless you've got an extremely agressive cleaner, the epoxy should hold the parts during the delay time. That's their job basically. We ran reflow first pass, glue parts, then wave solder second pass. There were potential delays between adhesive b
Electronics Forum | Mon Sep 14 16:14:23 EDT 1998 | Jeff Sanchez
| Dear Larry, | I developed the ultrasonic cleaning process for Smart Sonic. It has developed into the most widely used stencil and misprinted PCB cleaning process worldwide. With that in mind, I offer some words of caution. "IT'S NOT THE ULTRASON
Electronics Forum | Tue Sep 15 12:11:36 EDT 1998 | Bill Schreiber
Jeff, The use of flux thinner would only add another chemical to the process. Environmentally, that would not be a good idea. My guess is that you would only end up with "thinner jelly" anyway. Alcohol works well on RMA flux. When assemblers switch f
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