Electronics Forum | Sat Sep 01 18:14:39 EDT 2001 | Dreamsniper
your glue volume measurement is dictated by your stencil aperture size and thickness when you use stencil printing. Why you need to measure your glue volume deposition? I don't think that this is the right way yet for your undefined problem. What's t
Electronics Forum | Thu Oct 02 17:54:46 EDT 2003 | davef
Yes, Russ IPC-6012A w A#1 - Qualification & Performance For Rigid Printed Boards talks to solder mask requirements in 3.8. One interpretation of what it says: * Solder resist [solder mask] must meet the qualification / conformance requirements of S
Electronics Forum | Fri Sep 25 16:47:57 EDT 2009 | esoderberg
0.5mm pitch QFP's are typically mixed with large components on all of my boards. I usually use a 6 mil stencil with a minimum aperture width of 10 mils. Normal aperture size is 10 x 50 which causes shorts about 20% of the time. A recent purchase of
Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef
What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt
Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef
Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,
Electronics Forum | Thu Jan 12 02:08:47 EST 2006 | adeline_ko
Hi, What is the different between Electroless Nickel / Immersion Gold (ENIG) and Immersion Au. Are they refer to the same finishing? We has been using the Gold thickness (0.00005 - 0.00013mm) , nicket (0.0025mm) for all Gold finishing brd (Immersio
Electronics Forum | Sat Nov 17 11:36:16 EST 2007 | etienne
On a Dek Horizon 03 the tact time for one panel measuring 400mm print stroke took me 16 seconds at a speed of 55mm/sec. I see no reason for reducing further tact time since loading and unloading PCBs from Pick & Place machines is relatively close.
Electronics Forum | Fri Jan 06 11:29:28 EST 2006 | mdemos1
Hi. I was curious what some common accept/reject criteria would be on copper wall thickness. For instance, if 1 ounce copper is used, I believe the IPC specification is 0.001" minimum thickness. Should the order be rejected if there is one measure
Electronics Forum | Fri Jan 06 17:20:47 EST 2006 | davef
Mike You get what you ask for. We ask for 0.001 inch minimum. If your supplier's published process range allows thickness below 0.001 inch minimum, you need to define your own acceptance criterion. We don't use average measurements in lot inspect
Electronics Forum | Tue Jul 14 07:23:50 EDT 2020 | researchmfg
There is a misunderstanding that people think the IMC layer grows the thicker the stronger soldering strength. The IMC layer can be grown and distributed evenly at the interface location will be good enough. Once the IMC layer grows too thick and ove
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