Electronics Forum | Sun Nov 26 08:21:41 EST 2006 | callckq
Dear All, Is anyone know why too much solder paste might cause tombstoning defect? Thanks
Electronics Forum | Mon Feb 18 03:40:04 EST 2008 | akareti
Hi everybody, I found a defect varistor 0603 Tombstone and poor welting when we use component that terminal is Silver palladium (Ag/ Pd) with Leaded solder paste (63/37). Then we change alternative component that terminal is Ni/ Sn the result not fou
Electronics Forum | Mon Sep 21 08:14:14 EDT 1998 | Steve Gregory
| Hello: | I would like to know what causes tombstombing and how can it be prevented? | Thx. | Nichol Hi Nichol! A tombstone happens when solder doesn't wet equally on both terminations during reflow...now why that happens can be found by looking at
Electronics Forum | Thu Feb 24 10:29:27 EST 2000 | Shravan Jumani
Iam doing some work with O2O1s and am facing tombstoning problems. From screening experiments I find that a N2 reflow results in more number of tombstones than in Air. Would appreciate anyones inputs on why this happens, or how I should tackle the pr
Electronics Forum | Thu Feb 24 10:29:34 EST 2000 | Shravan Jumani
Iam doing some work with O2O1s and am facing tombstoning problems. From screening experiments I find that a N2 reflow results in more number of tombstones than in Air. Would appreciate anyones inputs on why this happens, or how I should tackle the pr
Electronics Forum | Thu Mar 02 09:23:05 EST 2006 | Bob R.
I never understood the statement "process indicator". The 7095 committee used that wording but didn't explain it. Other than really unusual cases such as champagne voiding, BGA voids are not a reliability issue. A half dozen studies have come to t
Electronics Forum | Thu Oct 31 14:35:19 EST 2002 | russ
You may want to turn the nitrogen off altogether, in searching through the archives it has been stated and proven by many people that this could help a lot. I don't know why it appears to be outside temperature related. Could it be that the PPM le
Electronics Forum | Tue Dec 01 13:15:32 EST 2015 | sfeinsp
why you need to verify every day? We do it only if machine start missing a lot, and using board with banch of misalignment's, tombstones and other problems.
Electronics Forum | Fri Dec 08 18:37:01 EST 2000 | Dave F
Asymetry in heating or mechanical forces are the primary reasons for tombstoning regardless of the reflow method. [There's beaucoup of background in the fine SMTnet Archive on reflow tomstoning.] Your situation is curious, but at least you know why
Electronics Forum | Tue Nov 28 11:12:48 EST 2006 | billwestiet
The ONLY (unlikely) cause I could think of is if you are pushing the component into the solder, ending up with more solder on one side than the other. Why do you think it is the volume of solder that is causing this? By the way, there are "low tomb
