Electronics Forum | Tue Oct 23 07:03:52 EDT 2007 | davef
We're not really sure. Usually when solder leaves the pads and wicks-up a component lead, it means the component lead is much warmer than the pad on the board. This is the direction we would have taken this if we hadn't taken the AgPd / conductive e
Electronics Forum | Tue Sep 16 17:03:34 EDT 2014 | rangarajd
We have an issue with solder wicking up the leads/ inside terminations on an SMT connector. The solder coverage is sometimes over 50% of the connectors inside pin length. The terminations are gold plated. Is there an IPC spec for acceptability? Plea
Electronics Forum | Sun Sep 21 10:03:15 EDT 2014 | gascon5383
hi, there is an IPC standard, IPC-A-610 - Acceptability of Electronic Assemblies. According to this manual, solder in the bends of a lead does not matter, but solder touching the body of a component is a defect. I cannot find a specific reference in
Electronics Forum | Wed Sep 02 15:02:36 EDT 2020 | SMTA-64387501
We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned po
Electronics Forum | Fri Feb 24 13:04:17 EST 2006 | patrickbruneel
Hi All, The change over to lead-free is as easy or as difficult as you want to make it The big problem I see with this lead-free transition is that there is no benchmark of acceptability and no defect data (yet) related to visual appearance of a sol
Electronics Forum | Fri Feb 24 06:49:59 EST 2006 | billyd
The really crazy part is, the way the Europeans wrote up the law, it holds the retailers responsible for getting rid of, and not possessing, leaded devices. They're the ones left holding the bag when things don't happen as they should. They get fined
Electronics Forum | Mon May 14 09:43:37 EDT 2001 | orbotech
As the face of business changes through revolutionary factors, such as the increasing rate of outsourcing, manufacturers (especially EMS plants) will strive to fine tune their test strategies to ultimately improve and sustain product quality and to r
Electronics Forum | Sat Apr 28 11:55:39 EDT 2001 | kaoni
Well, I hope I don't offend anyone. I'm brand new to this. I am considering starting my own assembly line to handle my own products but would like to be able to utilize my downtime as an opportunity to keep the machines running by trying to pick up a
Electronics Forum | Mon May 24 10:33:08 EDT 1999 | Jim Zanolli
Hello John: Teka Interconnection Systems offers an alternative to intrusive reflow for connectors. We can supply the connector with solder and flux pre-applied to each lead. Our system also includes a built in "solder stop" mechanism preventing th
Electronics Forum | Mon Aug 11 10:45:04 EDT 2008 | eyalg
I assume you mean the balls of the BGA, not pads > (laugh it up guys - I said balls). If so, you > may have a no-lead BGA or a high temp BGA. hi I mean that the the balls were left on the board and the BGA pads were found clean. What do you
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