Electronics Forum | Thu Aug 19 14:54:44 EDT 2010 | jamyboy
Has anyone out there successfully switched from First Pass Yield to DPMO metrics and most importantly, sold MGMT on the change?
Electronics Forum | Thu Jan 16 05:42:18 EST 2003 | nifhail
I've a query. I have one new Customer whom insisted us to use RMA paste on their product. The problem is, on some of their products they use via hole as the test point in where all the PCB finished are ENTEK and as usual I have to print solder paste
Electronics Forum | Mon Jun 18 16:13:47 EDT 2001 | calipso
If a PCB is already going through ICT and some additional inspection method is desired to increase first pass test yield rates, what are the advantages/disadvantages of AOI vs XRay? The most common problems seen are missing or skewed components and i
Electronics Forum | Tue Jul 14 16:53:43 EDT 1998 | B. Decker
| | | Dear Colleagues: | | I am looking for quantiative data on comparing the effects of depaneling/routing versus other forms of singulation specifically shearing, | | I need data not opinions. | | Thanks in advance for your help. | | Sincerely
Electronics Forum | Wed Jul 15 19:54:47 EDT 1998 | ZULFIQAR
| | | | | | Dear Colleagues: | | | I am looking for quantiative data on comparing the effects of depaneling/routing versus other forms of singulation specifically shearing, | | | I need data not opinions. | | | Thanks in advance for your help.
Electronics Forum | Tue Jul 17 12:03:29 EDT 2001 | mriddle
I am the director of sales & marketing for ASC International. I am concerned by the remark that "ASC has perculiar business practices, that worry would-be-buyers of their machine(s)...." Please elaborate so that we can act swiftly to correct any unf
Electronics Forum | Thu Mar 15 13:39:06 EDT 2018 | gregp
Impact is the instantaneous force at the time the component first reaches the PCB. F=M*a....so the acceleration is the key factor. If charted on a graph it would look like a spike...higher force for a short duration. The placement force is typical
Electronics Forum | Thu Mar 05 03:01:06 EST 2020 | leo_dektec
Hello toki, The only factor you need to consider is the production yield. If the volume is really high, need two smt line to run continually to meet the production, then u have no choice. If the volume is not that much, then u can consider below smt
Electronics Forum | Fri Jan 29 16:17:13 EST 2021 | donnie15
The impact is low on larger pitches and pad sizes. as things get to the .4mm pitch the pad differences start affect your ball size and yields. The trace size going into the pads and the solder mask relief can cause some odd shaped pads with signif
Electronics Forum | Wed Jan 28 10:56:31 EST 2004 | russ
the reason you don't want to use PPM is exactly the reason you need to. You cannot compare a square 1" block to a multi faceted custom machine part. In SMT assembly you will usually find that all 0603 and larger discreetes,25mil pitch, etc. are pro
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