PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALLIANCE&PN=AS4C16M16SA-7BCNTR
: Active Updated: 12/5/2022 Mounting Type: Surface Mount Logical Description: IC, DRAM 256 Mb Parallel Physical Description: Ball Grid Array (BGA) 0.80 mm pitch, square; 54 pin, 8.00 mm L X 8.00 mm W X 1.20 mm H body Commonly Visited: Discussion Forum Software User Guide Free Downloads Contact us Websites Contact Sales, Training, Support
KingFei SMT Tech | https://www.smtspare-parts.com/sale-35519362-kgt-m712s-a1x-standard-shaft-2-yg200-head-shaft-assy-kgt-m713s-a0x.html
: YV100X Shaft Part Number:KGT-M712S-A1X KGT-M713S-A0X Condition: Original new Machine Model: YG200 YAMAHA KGT-M712S-A1X S.T.D. SHAFT 1, SPARE YG200 YAMAHA KG7-M7173-A0X head shaft YAMAHA YV88II (5322 256 92337
| http://etasmt.com/cc?pageID=newsList&ID=te_news,0&pNum=20
. Show Details Solder Ball Defects Solder Ball Defects Show Details Reflow Soldering Problems The reflow soldering profile must be matched to the specific requirements of the solder paste as well as
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
@nordsondage.com ABSTRACT The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
@nordsondage.com ABSTRACT The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion
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