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. In many cases, X-Ray inspection (2D and 3D) provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through holes, TSVs, micro-bumps, copper pillars, etc
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508.5 In-line Flux and Preheat Automatic Solder Inspection Technologies Overview - All 1D and 2D Barcode Reader 2Segment Configuration Board Warp Sensing Closed Loop In Process Flux Verification
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508.5 In-line Flux and Preheat Automatic Solder Inspection Technologies Overview - All 1D and 2D Barcode Reader 2Segment Configuration Board Warp Sensing Closed Loop In Process Flux Verification
Lewis & Clark | https://www.lewis-clark.com/product-tag/2d-inspection/
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Lewis & Clark | https://www.lewis-clark.com/product-tag/mydata-2d-hydra/
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/soldering-processes/aoi-solder-joint-inspection
508.5 In-line Flux and Preheat Automatic Solder Inspection Technologies Overview - All 1D and 2D Barcode Reader 2Segment Configuration Board Warp Sensing Closed Loop In Process Flux Verification
