PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_what-is-ipc-compliance_topic2232.xml
= No requirement has beenestablished for this ClassA = AcceptableP = Process IndicatorD = DefectExamples:[A1P2D3] is Acceptable Class 1,Process Indicator Class 2 and Defect Class 3[N1D2D3]
| https://www.eptac.com/faqs/ask-helena-leo/ask/interpretation-of-the-j-std-001-ipc-a-610-turret-terminal-soldering
) has an acceptable filet and wetting is evident between the base of the Turret and the top side (solder destination side) the joint would be acceptable
| https://www.eptac.com/ask/interpretation-of-the-j-std-001-ipc-a-610-turret-terminal-soldering/
) has an acceptable filet and wetting is evident between the base of the Turret and the top side (solder destination side) the joint would be acceptable
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-led-encapsulation.php
) technology excels with larger LED encapsulation. Highly repeatable results are achieved with an effective dispense rates of 3 ml/min . No other dispense technology can meet this dispense rate at the consistency of PCD
GPD Global | https://www.gpd-global.com/fluid-dispense-led-encapsulation.php
) technology excels with larger LED encapsulation. Highly repeatable results are achieved with an effective dispense rates of 3 ml/min . No other dispense technology can meet this dispense rate at the consistency of PCD
GPD Global | https://www.gpd-global.com/led-encapsulation.php
) technology excels with larger LED encapsulation. Highly repeatable results are achieved with an effective dispense rates of 3 ml/min . No other dispense technology can meet this dispense rate at the consistency of PCD
| https://www.eptac.com/faqs/ask-helena-leo/ask/post-lead-trimming-reflow-requirements
. Therefore all documents agree on how this condition is to be addressed. There are no requirement in this section where the leads must be covered with solder
| https://www.eptac.com/soldertips/soldertips-soldering-iron-calibration-do-you-really-have-to/
. The recovery rate of the iron should also be defined to verify the that the system does not overshoot the top side temperature which would allow a solder joint to be created at a high temperature
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/what-is-ipc-compliance_topic2232.html
= No requirement has been established for this Class A = Acceptable P = Process Indicator D = Defect Examples: [A1P2D3] is Acceptable Class 1, Process Indicator Class 2 and Defect Class 3 [N1D2D3
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/what-is-ipc-compliance_topic2232_post9236.html
= No requirement has been established for this Class A = Acceptable P = Process Indicator D = Defect Examples: [A1P2D3] is Acceptable Class 1, Process Indicator Class 2 and Defect Class 3 [N1D2D3
