Heller Industries Inc. | https://hellerindustries.com/curing-oven/
: Process time: Generally 120 min or User’s spec Operating temp: 60oC ~ 200oC Maximum temp: 220oC Operating pressure: 1 bar – 10 bar Capacity: 24 Magazines (typical) Cooling method: PCW (17oC – 23oC) Cooling water pressure
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=4
. The cold bump pull test method is required as traditional shear testing tends to deform the solder ball during the test such that the area of attach can become damaged during the process
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALTERA&PN=EP2S180F1508I4
: IC, Stratix II, 1.2-V, 90-nm, All-Layer Copper SRAM Process Physical Description: Ball Grid Array (BGA), 1.00 mm pitch, square; 1508 pin, 40.00 mm L X 40.00 mm W X 3.50 mm H body Manufacturer
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALTERA&PN=EP2S90F1508C4
: IC, Stratix II, 1.2-V, 90-nm, All-Layer Copper SRAM Process Physical Description: Ball Grid Array (BGA), 1.00 mm pitch, square; 1508 pin, 40.00 mm L X 40.00 mm W X 3.50 mm H body Manufacturer
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALTERA&PN=EP2S180F1508C3
: IC, Stratix II, 1.2-V, 90-nm, All-Layer Copper SRAM Process Physical Description: Ball Grid Array (BGA), 1.00 mm pitch, square; 1508 pin, 40.00 mm L X 40.00 mm W X 3.50 mm H body Manufacturer
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALTERA&PN=EP2S180F1508C4
: IC, Stratix II, 1.2-V, 90-nm, All-Layer Copper SRAM Process Physical Description: Ball Grid Array (BGA), 1.00 mm pitch, square; 1508 pin, 40.00 mm L X 40.00 mm W X 3.50 mm H body Manufacturer
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALTERA&PN=EP2S180F1508C5
: IC, Stratix II, 1.2-V, 90-nm, All-Layer Copper SRAM Process Physical Description: Ball Grid Array (BGA), 1.00 mm pitch, square; 1508 pin, 40.00 mm L X 40.00 mm W X 3.50 mm H body Manufacturer
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALTERA&PN=EP2S90F1508C5
: IC, Stratix II, 1.2-V, 90-nm, All-Layer Copper SRAM Process Physical Description: Ball Grid Array (BGA), 1.00 mm pitch, square; 1508 pin, 40.00 mm L X 40.00 mm W X 3.50 mm H body Manufacturer
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALTERA&PN=EP2S90F1508I4
: IC, Stratix II, 1.2-V, 90-nm, All-Layer Copper SRAM Process Physical Description: Ball Grid Array (BGA), 1.00 mm pitch, square; 1508 pin, 40.00 mm L X 40.00 mm W X 3.50 mm H body Manufacturer
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=9
. The cold bump pull test method is required as traditional shear testing tends to deform the solder ball during the test such that the area of attach can become damaged during the process
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