ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-assembly-and-packaging?con=t&page=14
) provide the best in the industry X-ray inspection solutions for production, engineering, R&D, and failure analysis. Easy to use, providing highest quality images with sub-micron resolution (market leading
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/workshops.cfm
: Failure Analysis of Electronic Devices M. Simard-Normandin, Ph.D., MuAnalysis Inc. Course Objectives: The supply chain of electronic devices is large and complex
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=18
. This is done by screening combinations of solder ball alloys and under bump metallization for various industry standard failure modes by identifying the presence of voids at the UBM interface that
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=4
borescope imaging system (similar to an endoscope) and the sample being tested can be displayed on an LCD monitor enabling the operator to easily align the shear tool to the ball bond and more accurately assign a failure mode grade
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=7
. This is done by screening combinations of solder ball alloys and under bump metallization for various industry standard failure modes by identifying the presence of voids at the UBM interface that
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/x-ray-inspection
. Inspect BGA and QFN attachment, solder shorts, PTH filling and detect counterfeit components. Quadra 5 excels at challenging workflows
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=12
. This is done by screening combinations of solder ball alloys and under bump metallization for various industry standard failure modes by identifying the presence of voids at the UBM interface that
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=5
. This is done by screening combinations of solder ball alloys and under bump metallization for various industry standard failure modes by identifying the presence of voids at the UBM interface that
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